Browse Materials
Back to materialsAlN
Aluminum Nitride
An electrically insulating ceramic for efficient heat dissipation in power electronics, LED and semiconductor applications.
High thermal conductivity electronic ceramics
Technical specifications
Typical reference data for first-round screening.
Values are typical engineering references. Final material selection should confirm grade, process route, geometry, tolerance and test method.
| Density | 3.30 g/cm³ typical |
|---|---|
| Hardness | ≈11.0 GPa (converted from HV1 1122) |
| Max service temperature | 1,000 °C in air for the referenced grade |
| Thermal conductivity | 170 W/(m·K) at room temperature |
| Flexural strength | 470 MPa typical at room temperature |
| Fracture toughness | 2.6 MPa·m¹/² typical |
| Electrical behavior | High electrical insulation |
Typical applications
- Power module substrates and heat spreaders
- LED packages, laser diode carriers and electronic substrates
- Semiconductor equipment components requiring thermal control
- Insulated heat-transfer plates for high-power devices
Advantages
- High thermal conductivity with electrical insulation
- Low thermal expansion compared with many ceramics
- Good compatibility with metallization processes
- Strong choice when alumina cannot remove enough heat
Comparison notes
- Choose AlN over alumina when heat dissipation is the limiting requirement.
- AlN is usually selected for electronics rather than abrasive wear or heavy structural load.
Application review
Not sure if AlN is the right material?
Send the working temperature, medium, wear mode, load, drawing, current failure problem and quantity. We can compare Aluminum Nitride against other ceramic options.
Ask for recommendation