Direct-Bonded Copper Substrates for Thick-Film Circuits
Ceramic Substrate
SKU: FWM/CS-DBC-003
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
DBC Copper-Clad Substrate
Representative substrate form for drawing review.
Custom DBC Circuit
Processing route and features are confirmed during RFQ review.
- Material
- Ceramic / Direct-Bonded Copper System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- Thick-Film Power Circuits
DBC substrates for thick-film power circuits requiring robust bonded copper and electrical insulation.
Metallized substrates require more than an outline drawing.
Browse Products
Alumina Ceramic Products
Zirconia Ceramic Products
Silicon Carbide Products
Silicon Nitride Products
Aluminum Nitride Products
Product Description
Review material position, substrate forms and processing scope.
DBC substrates for thick-film power circuits requiring robust bonded copper and electrical insulation.
Copper foil bonded to alumina or AlN for high-current, thermally robust circuits.
The quote combines ceramic, copper, layout, finish and assembly requirements.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- DBC — Direct Bonded Copper
- 0.10–0.30 mm copper reference
- Power electronics
Typical Applications
- Thick-Film Power Circuits
- Hybrid Electronics
Technical Data
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | 96% Al2O3 or AlN | Route dependent |
| Ceramic thickness | 0.25–1.0 mm reference | Selected combinations |
| Copper thickness | 0.10–0.30 mm | Other combinations on request |
| Line / space | 0.30 / 0.30 mm conservative starting reference | Depends on copper thickness and geometry |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Available to agreed specification | Test method and geometry must be defined |
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Alumina DBC Substrates
- Aluminum Nitride DBC Substrates
- Single- and Double-Sided Copper
- Custom Thick-Copper Circuits
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | DBC: 5-9 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination