Aluminum Nitride Electronic Ceramic Components
Aluminum Nitride Ceramics Component
SKU: FWM/ALN-EC-001
- Material
- Aluminum Nitride Ceramic Family
- Size
- Custom sizes available
- MOQ
- Pending Verification
- Applications
- Semiconductor Manufacturing
Drawing-based aluminum nitride components for semiconductor, packaging and high-power electronic assemblies.
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Product Description
Drawing-based aluminum nitride components for semiconductor, packaging and high-power electronic assemblies.
Aluminum nitride electronic ceramic components cover featured plates, carriers, supports and structural forms used in thermal-management systems.
Their combination of thermal conductivity and electrical insulation allows a carrier or support to move heat away from an electronic device without becoming an electrical conductor. Metallization and joining are separate options from the unmetalized ceramic body.
Product Features
- Thermal Management
- Electrical Insulation
- Electronic Integration
- Precision Feature Machining
Typical Applications
- Semiconductor Manufacturing — Thermal and insulating equipment components: Supports clean, stable component interfaces after drawing review.
- Electronic Packaging — Carriers, supports and thermal interfaces: Provides a custom ceramic option for compact electronic assemblies.
Product Geometry & Configuration
AlN (AN216A) Typical Properties
| Property | AN216A typical value | Condition / method |
|---|---|---|
| Density | 3.4 g/cm³ | JIS R 1634 |
| Water absorption | 0 % | JIS C 2141 |
| Vickers hardness | 10.4 GPa | HV9.807N (9.807 N load); JIS R 1610 |
| Three-point flexural strength | 310 MPa | Three-point bending; JIS R 1601 |
| Young’s modulus | 320 GPa | JIS R 1602 |
| Poisson’s ratio | 0.24 | JIS R 1602 |
| Fracture toughness (SEPB) | 3.2 MPa·m½ | SEPB; JIS R 1607 |
| Linear thermal expansion, 40–400°C | 4.6 × 10⁻⁶/K | 40–400°C; JIS R 1618 |
| Linear thermal expansion, 40–800°C | 5.3 × 10⁻⁶/K | 40–800°C; JIS R 1618 |
| Thermal conductivity | 150 W/(m·K) | 20°C; JIS R 1611 |
| Specific heat capacity | 0.71 J/(g·K) | JIS R 1611 |
| Material thermal-shock temperature difference | 250 °C | Water immersion; relative method; JIS R 1648 |
| Dielectric strength | 14 kV/mm | JIS C 2141 |
| Volume resistivity, 20°C | >10¹⁴ Ω·cm | 20°C; JIS C 2141 |
| Volume resistivity, 300°C | 10¹⁰ Ω·cm | 300°C; JIS C 2141 |
| Volume resistivity, 500°C | 10⁸ Ω·cm | 500°C; JIS C 2141 |
| Relative permittivity | 8.6 | 1 MHz; JIS C 2141 |
| Dielectric loss tangent | 0.0003 | 1 MHz; JIS C 2141 |
Product Geometry & Configuration
| Product parameter | Configuration | Basis |
|---|---|---|
| Material system | Aluminum Nitride Ceramic Family | Material family; grade selected for the application |
| Component forms | Featured plates and carriers; Rings, discs and supports; Drawing-based electronic ceramic components | Drawing-defined configurations |
| Geometry and dimensions | Custom sizes available | Part drawing and mating interfaces |
| Functional surfaces | Contact, locating, joining or insulating surfaces as applicable | Surface finish and acceptance criteria on the drawing |
Available Forms
Representative forms are shown for selection. Final geometry, material route, interface, finish and acceptance criteria require drawing review.
- Featured plates and carriers
- Rings, discs and supports
- Drawing-based electronic ceramic components
Packaging & Shipping
Packing and shipment arrangements are selected for the confirmed component geometry and surface requirements.
| Item | Details |
|---|---|
| Product protection | Selected for geometry, surface condition and quantity |
| Other commercial terms and lead time | Confirmed in quotation |
| Source boundary | No competitor packaging or delivery promise is inherited. |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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