Material-Specific Product Family
96% and high-purity alumina substrate options for electrical insulation, electronic circuits and precision ceramic applications, with custom processing and prototype-to-production support.
Material & Process Filter
Only technically compatible routes are shown. Select one or more processes to compare matching products; clear the selection to return to the base-material portfolio.
Alumina grade
Product Family Portfolio
Select a product route for detailed application and drawing-review guidance.
5 products
96% Alumina Ceramic Substrates
96% alumina insulating substrates for thermoelectric module assembly, reviewed for outline, thickness, surface condition and circuit requirements.
Typical application directions
Thermoelectric Modules · Electronic Insulation
View Product Details96% Alumina Ceramic Substrates
96% alumina substrates with drawing-defined laser holes for electronic circuits, packaging and precision assembly.
Typical application directions
Electronic Packaging · Circuit Substrates
View Product Details96% Alumina Ceramic Substrates
Large-format 96% alumina substrate configurations reviewed for thickness, flatness, warpage and downstream processing.
Typical application directions
Large Electronic Panels · Industrial Electronics
View Product Details96% Alumina Ceramic Substrates
96% alumina substrates with controlled laser scribing for circuit-panel separation and integrated-circuit production.
Typical application directions
Integrated Circuits · Hybrid Circuits
View Product Details96% Alumina Ceramic Substrates
Surface-controlled alumina substrates for thin-film integrated circuits and precision electronic packaging.
Typical application directions
Thin-Film Circuits · Microelectronics
View Product DetailsProduct Family Portfolio
Select a product route for detailed application and drawing-review guidance.
7 products
99.6% Alumina Ceramic Substrates
High-purity alumina substrates for optoelectronic transceiver packaging, precision circuits and electrically insulating carriers.
Typical application directions
Optical Transceivers · Optoelectronic Packaging
View Product Details99.6% Alumina Ceramic Substrates
High-purity alumina substrates for stable crystal-oscillator circuit support and microelectronic packaging.
Typical application directions
Crystal Oscillators · Frequency-Control Modules
View Product Details99.6% Alumina Ceramic Substrates
99.6% alumina substrates for precision electronic assemblies requiring high insulation and controlled surface quality.
Typical application directions
High-Performance Electronics · Electronic Packaging
View Product Details99.6% Alumina Ceramic Substrates
Polished high-purity alumina substrates for thin-film, optical and precision microelectronic processes.
Typical application directions
Thin-Film Circuits · Optoelectronics
View Product Details99.6% Alumina Ceramic Substrates
High-purity alumina substrate panels for chip-resistor manufacturing and precision thick-film processing.
Typical application directions
Chip Resistors · Thick-Film Circuits
View Product Details99.6% Alumina Ceramic Substrates
High-purity alumina substrates for electrically insulating power-module carriers and controlled circuit processing.
Typical application directions
Power Modules · Industrial Power Electronics
View Product DetailsRelated Co-Fired Technology
LTCC is a glass-ceramic multilayer route, not a 96% or 99.6% dense alumina grade. It is kept here as a clearly separated related electronic-substrate option.
LTCC Glass-Ceramic
Low-temperature co-fired glass-ceramic multilayer substrates for high-frequency and compact electronic packaging; this route is related to, but not classified as, 96% or 99.6% dense alumina.
Typical application directions
High-Frequency Packages · Optical Communication
View Product DetailsAvailable Grades
These grade positions support early product-family selection. Final composition, acceptance criteria and processing route are confirmed during RFQ review.
Material Grade
A cost-effective substrate option for general electronic applications and electrical insulation.
Material Grade
A high-purity substrate option for precision electronics and demanding surface-quality requirements.
Processing Capabilities
The processing route is reviewed against substrate thickness, feature layout, surface requirements, drawing and order needs.
Typical Material Properties
Published values are typical material references. Test method, temperature, frequency and selected grade affect final values.
| Property | 96% Alumina | 99.6% Alumina |
|---|---|---|
| Al2O3 content | 96% | 99.6% |
| Density | 3.70–3.78 g/cm³ typical | 3.86–3.96 g/cm³ typical |
| Flexural strength | 310–450 MPa typical | 470–550 MPa typical |
| Thermal conductivity | 20–25 W/m·K typical | 27–30 W/m·K typical |
| CTE | 6.7–7.2 × 10⁻⁶/K typical | 6.8–7.2 × 10⁻⁶/K typical |
| Dielectric strength | >15 kV/mm, depending on thickness and test method | >15 kV/mm, depending on thickness and test method |
| Dielectric constant | About 9.8 at 1 MHz | About 9.7–9.9 at 1 MHz |
| Volume resistivity | >10¹⁴ Ω·cm typical at 25 °C | >10¹⁴ Ω·cm typical at 25 °C |
| Water absorption | 0% nominal for dense ceramic | 0% nominal for dense ceramic |
Available Specifications
Availability depends on grade, dimensions, thickness, surface condition and processing route.
| Item | Website reference | Condition |
|---|---|---|
| Thickness | 0.25–2.0 mm commercial range | Not every size and grade combination |
| Size | Standard formats up to approximately 140 × 190 mm | Subject to thickness, grade and drawing review |
| Dimensional tolerance | ±0.2 mm standard reference | Tighter tolerances may be available |
| Thickness tolerance | Standard fired tolerance | Lapped tolerance available on request |
| Flatness / warpage | ≤0.3% of length general as-fired reference | Depends on dimensions and thickness |
| Surface roughness | As-fired Ra typically 0.3–0.6 µm | Lapped and polished surfaces available |
| Surface / edge finish | As-fired, lapped or polished; finished edges on request | Subject to drawing review |
| Holes / slots | Laser-drilled holes, slots, grooves and scribe lines | Feature limits depend on thickness and geometry |
Product Solutions
These configurations describe sourcing needs, not separate material grades. Each option is reviewed against the drawing, surface, feature and order requirements.
Typical Applications
The final grade and processing route depend on the circuit, assembly, surface and operating requirements.
Custom Manufacturing
Processing and inspection are selected for the grade, geometry and assembly process.
Quality & Inspection
Documentation and inspection scope are available on request and agreed during quotation.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
Ordering Information
Typical lead times depend on specification, quantity, material availability, drawing and inspection requirements.
Recommended MOQ
10 pieces
Bare substrates
2–4 weeks
Custom processing
3–5 weeks
Metallized
4–8 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
96% alumina is the established economical grade for thick-film and general electronics. 99.6% alumina supports higher-purity, polished, thin-film and precision applications.
Yes. Feature size and tolerance depend on substrate thickness, aspect ratio, edge distance and chipping criteria.
Lapped and polished surfaces are available on request. Specify Ra, flatness, thickness tolerance and the downstream metallization or assembly process.
The recommended MOQ is 10 pieces. Typical lead time is 2–4 weeks for bare substrates, 3–5 weeks with custom processing and 4–8 weeks for metallized work, depending on specification and quantity.
Material reference
Review the separate alumina material page for material context and grade-selection guidance.
What to Specify for Your RFQ
Clear product and processing details help the team review feasibility, material grade and the appropriate quotation scope.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.