Ceramic Insulating Substrates for Thermoelectric Modules
96% alumina insulating substrates for thermoelectric module assembly, reviewed for outline, thickness, surface condition and circuit requirements.
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Material-Specific Product Family
Alumina Ceramic Substrates: 96% and 99.6% Al2O3
Alumina ceramic substrates are rigid insulating plates for printed or deposited circuits, electronic packages and component carriers.
Product Description
Alumina ceramic substrates are rigid insulating plates for printed or deposited circuits, electronic packages and component carriers. The 96% and 99.6% material groups remain separate so purity, electrical properties and surface requirements can be matched to the process.
Bare blanks can be supplied in drawing-defined outlines with holes, slots or scribe patterns. Lapping and polishing define the surface state; they do not change the alumina purity. Copper-clad and co-fired constructions are selected as separate product routes.
Material & Process Filter
Filter compatible substrate processes.
Only technically compatible routes are shown. Select one or more processes to compare matching products; clear the selection to return to the base-material portfolio.
Alumina grade
Product Family Portfolio
96% Alumina Ceramic Substrates
Select a product route for detailed application and drawing-review guidance.
5 products
Laser-Drilled Alumina Ceramic Substrates
96% alumina substrates with drawing-defined laser holes for electronic circuits, packaging and precision assembly.
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Large-Size Low-Warpage Alumina Ceramic Substrates
Large-format 96% alumina substrate configurations reviewed for thickness, flatness, warpage and downstream processing.
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Laser-Scribed Alumina Substrates for Integrated Circuits
96% alumina substrates with controlled laser scribing for circuit-panel separation and integrated-circuit production.
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Alumina Substrates for Thin-Film Integrated Circuits
Surface-controlled alumina substrates for thin-film integrated circuits and precision electronic packaging.
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99.6% Alumina Ceramic Substrates
Select a product route for detailed application and drawing-review guidance.
7 products
Alumina Ceramic Substrates for Optoelectronic Transceiver Modules
High-purity alumina substrates for optoelectronic transceiver packaging, precision circuits and electrically insulating carriers.
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Alumina Ceramic Substrates for Crystal Oscillators
High-purity alumina substrates for stable crystal-oscillator circuit support and microelectronic packaging.
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Alumina Substrates for High-Performance Electronics
99.6% alumina substrates for precision electronic assemblies requiring high insulation and controlled surface quality.
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99.6% High-Purity Polished Alumina Ceramic Substrates
Polished high-purity alumina substrates for thin-film, optical and precision microelectronic processes.
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99.6% Alumina Ceramic Substrates for Chip Resistors
High-purity alumina substrate panels for chip-resistor manufacturing and precision thick-film processing.
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99.6% Alumina Substrates for High-Power Electronic Modules
High-purity alumina substrates for electrically insulating power-module carriers and controlled circuit processing.
View productRelated Co-Fired Technology
LTCC glass-ceramic substrates
LTCC is a glass-ceramic multilayer route, not a 96% or 99.6% dense alumina grade. It is kept here as a clearly separated related electronic-substrate option.
Product Advantages
- Electrical insulation separates conductive features while the ceramic supports components and circuit films.
- Rigid flat surfaces provide a carrier for thick-film printing, thin-film deposition and package assembly.
- The 96% and 99.6% choices allow material purity to be selected independently of the machining or surface finish.
- Laser features and controlled surfaces adapt the blank to panel separation, mounting and alignment.
Typical Applications
The final grade and processing route depend on the circuit, assembly, surface and operating requirements.
- LED Packaging
- Power Electronics
- Thin Film Circuits
- Thick Film Circuits
- Sensors
- Chip Resistors
- Optoelectronics
- Thermoelectric Modules
- RF / Microwave Electronics
Technical Data
Typical Material Selection Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
Typical Material Selection Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
Dimensions & Processing
Substrate Geometry & Surface
| Feature | Specification basis |
|---|---|
| Outline and thickness | Length × width × thickness; drawing-defined shape |
| Holes, slots and scribe patterns | Feature size, position, edge distance and residual thickness for scribing |
| Surface state | As-fired, lapped or polished; functional faces and roughness |
| Geometrical control | Thickness variation, flatness, warpage and measurement support |
| Edges and downstream processing | Edge/chipping criteria and the film, bonding or metallization process |
Available Grades
Select the alumina grade around the application.
These grade positions support early product-family selection. Final composition, acceptance criteria and processing route are confirmed during RFQ review.
Material Grade
96% Alumina
A cost-effective substrate option for general electronic applications and electrical insulation.
- General electronic applications
- Thick-film related applications
Material Grade
99.6% High-Purity Alumina
A high-purity substrate option for precision electronics and demanding surface-quality requirements.
- Thin-film related requirements
- Precision electronics
Product configuration
Processing & Configuration
The processing route is reviewed against substrate thickness, feature layout, surface requirements, drawing and order needs.
- Laser Drilling
- Laser Scribing
- Laser Cutting
- Precision Cutting
- Polishing
- Custom Holes / Slots
- Metallization
- Laser-cut outlines
- Custom holes, slots and grooves
- Grinding and edge finishing
- Lapping and polishing
- Thick-film, thin-film, DPC, DBC and selected Mo-Mn metallization
- Drawing-based inspection plans
Product Solutions
Commercial substrate configurations for RFQ review.
These configurations describe sourcing needs, not separate material grades. Each option is reviewed against the drawing, surface, feature and order requirements.
- Standard Alumina Ceramic Substrates
- Laser-Drilled Alumina Ceramic Substrates
- Laser-Scribed Alumina Ceramic Substrates
- Polished Alumina Ceramic Substrates
- Large-Size / Low-Warpage Alumina Ceramic Substrates
Quality & Inspection
Inspection matched to the critical features.
Documentation and inspection scope are available on request and agreed during quotation.
- Material and grade review
- Dimensional and thickness inspection
- Flatness and warpage inspection
- Surface roughness and visual inspection
- Hole position and edge-quality checks
- Metallization inspection when specified
Material reference
Review the separate alumina material page for material context and grade-selection guidance.
Ordering Information
MOQ and typical lead time.
Price and delivery are provided for the specified enquiry; prototype and production quantities can be stated separately.
Recommended MOQ
By quotation
Quotation inputs
Drawing, material, finish, quantity and delivery destination
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Is a bare ceramic substrate the same as a ceramic PCB?
No. A bare substrate is the insulating ceramic base. A ceramic circuit board includes a conductor pattern and may include metallization, vias or assembly features. Specify whether the enquiry concerns bare ceramic, a metallized blank or a finished circuit.
Which dimensions and finish should I specify?
Include length, width, thickness, outline, hole or scribe pattern, critical tolerances, flatness and roughness. Identify the functional faces and the downstream film, bonding or metallization process.
How do I choose an alumina purity?
Match purity and surface condition to the circuit process, dielectric duty and contamination requirements. Thick-film and thin-film applications can have different priorities; higher purity is not a universal substitute for a complete specification.
When are price and delivery established?
Send the drawing, material and surface requirements, quantity and delivery destination. The quotation can then address the actual product and order rather than a generic website price or schedule.
Packaging & Shipping
Protect brittle edges and precision surfaces.
Packaging is selected for substrate finish, quantity and export handling.
- Individual separation
- Anti-scratch interlayers for polished surfaces
- Tray or foam protection
- Inner box and export carton
- Moisture protection where appropriate
- Wooden case for larger export consignments when required
What to Specify for Your RFQ
Provide the drawing and the requirements that control selection.
Clear product and processing details help the team review feasibility, material grade and the appropriate quotation scope.
- Alumina grade / purity
- Length × width
- Thickness
- Dimensional tolerance
- Flatness / warpage requirement
- Surface finish
- Hole size / pattern
- Laser drilling requirements
- Scribing requirements
- Metallization requirements
- Drawing
- Quantity
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.