Ceramic Substrate Product Finder
Combine material, process and application filters, or search by a product name or use case. Filters within one group are additive; different groups narrow the result together.
37 matching products
Filtered Product Portfolio
96% Alumina · Bare / Standard
96% alumina insulating substrates for thermoelectric module assembly, reviewed for outline, thickness, surface condition and circuit requirements.
Typical applications
Thermoelectric Modules · Electronic Insulation
View Product Details96% Alumina · Laser / Drilling
96% alumina substrates with drawing-defined laser holes for electronic circuits, packaging and precision assembly.
Typical applications
Electronic Packaging · Circuit Substrates
View Product Details96% Alumina · Bare / Standard
Large-format 96% alumina substrate configurations reviewed for thickness, flatness, warpage and downstream processing.
Typical applications
Large Electronic Panels · Industrial Electronics
View Product Details96% Alumina · Laser / Drilling
96% alumina substrates with controlled laser scribing for circuit-panel separation and integrated-circuit production.
Typical applications
Integrated Circuits · Hybrid Circuits
View Product Details96% Alumina · Bare / Standard
Surface-controlled alumina substrates for thin-film integrated circuits and precision electronic packaging.
Typical applications
Thin-Film Circuits · Microelectronics
View Product Details99.6% Alumina · Bare / Standard
High-purity alumina substrates for optoelectronic transceiver packaging, precision circuits and electrically insulating carriers.
Typical applications
Optical Transceivers · Optoelectronic Packaging
View Product DetailsMaterial Selection
These qualitative selection cues support early sourcing discussions. Final selection depends on the complete electrical, thermal, mechanical and processing requirements.
Cost-effective and established
A mature electronic substrate material with electrical insulation and broad processing availability.
Thermal management focus
Considered where higher thermal management capability and electrical insulation are both important.
Mechanical reliability focus
Considered for mechanical reliability and demanding thermal-cycling conditions in power-module applications.
Selection Guide
Use the two tables to compare copper-attachment technologies and ceramic base materials. On smaller screens, swipe horizontally to view every column.
| Factor | DBC | DPC | AMB |
|---|---|---|---|
| Process | Direct-bonded copper foil | Seed deposition, plated copper and patterning | Copper joined by active-metal braze |
| Ceramic Base | 96% Al2O3 or AlN | 96% / 99.6% Al2O3 or AlN | Si3N4 primary; selected AlN |
| Copper System | Thick bonded foil | Thin-to-medium controlled plated copper | Thick brazed copper |
| Copper Thickness | 0.10-0.30 mm standard range | 10-130 micrometers; 30-100 micrometers typical | 0.30 / 0.40 / 0.50 / 0.80 mm references |
| Circuit Precision | Medium | Highest of the three | Medium; power-layout oriented |
| Thermal Performance | Strong; AlN option lowers thermal resistance | Good for localized heat and precision packages | Strong system performance with high reliability |
| Mechanical Reliability | Good; layout and ceramic dependent | Best suited to compact, light-copper circuits | Highest severe-cycle positioning |
| Automotive Suitability | Medium-to-high by design | Selected sensors and optoelectronics | Very high positioning |
| Power Electronics | High | Low-to-medium depending on copper and current | Very high |
| Fine Circuits | Medium | High | Low-to-medium |
| Typical Applications | IGBT/MOSFET modules, drives and inverters | LED, laser, LiDAR, optical and RF packages | EV traction, SiC modules and automotive inverters |
| MOQ | 5 pcs or one master-card equivalent | 10 pcs or one master-card equivalent | 5 pcs or one master-card equivalent |
| Lead Time | 5-9 weeks | 5-8 weeks | 6-10 weeks |
| Property | Alumina | Aluminum Nitride | Silicon Nitride |
|---|---|---|---|
| Thermal Conductivity | About 20-30 W/(m K) typical, grade dependent | About 170 W/(m K) typical; higher grades available | About 80-90 W/(m K) typical for power-substrate grades |
| Electrical Insulation | Strong and widely established | Strong with high heat-transfer capability | Strong for power-module isolation |
| Mechanical Strength | Good general-purpose substrate strength | Good, but more brittle than Si3N4 | Highest strength positioning of these substrate bases |
| Fracture Toughness | Moderate | Lower than Si3N4 | Highest of these three substrate bases |
| Thermal-Cycle Reliability | Good when layout and copper are balanced | Good thermal path; stress design remains important | Best positioning for severe thermal cycling |
| Cost Position | Most economical and established | Premium thermal-management material | Premium reliability-focused material |
| Typical Copper Routes | DBC, DPC, thick film and thin film | DBC, DPC and selected AMB | AMB priority; selected other routes by review |
| Recommended Applications | General electronics, thick-film circuits and cost-sensitive modules | High heat-flow power electronics, LEDs and lasers | EV inverters, SiC modules and high-reliability power cycling |
Values and rankings are typical selection references, not guaranteed order specifications. Confirm material grade, geometry, copper thickness, circuit layout, finish, assembly process and test method during RFQ review.
Processing Capabilities
Processing routes are reviewed for the selected material, substrate geometry, feature pattern and inspection requirements.
Typical Applications
Application requirements guide material-family and processing review; the examples below are sourcing contexts rather than fixed specifications.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.