Aluminum Nitride AMB Copper-Clad Substrates
AlN-based AMB copper-clad substrates for power circuits requiring high heat transfer and robust metal-ceramic integration.
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AMB Product Family
AMB Ceramic Substrates for Power Electronics
AMB ceramic substrates join copper conductors to ceramic with an active-metal braze.
Product Description
AMB ceramic substrates join copper conductors to ceramic with an active-metal braze. The copper carries current and spreads heat, while the ceramic provides electrical isolation and support for power-module layouts.
Silicon nitride, aluminum nitride and alumina AMB constructions use different ceramic and braze combinations. Ceramic properties, layer thicknesses and copper distribution describe the same stack when thermal or mechanical behavior is assessed.
Product Family Portfolio
AMB Ceramic Substrate Products
Select a product route for detailed application and drawing-review guidance.
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Si3N4 AMB Copper-Clad Substrates for SiC Modules
Si3N4 AMB substrates for SiC power modules requiring high mechanical reliability and severe thermal cycling.
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AMB Ceramic Copper-Clad Substrates for New-Energy Systems
AMB copper-clad ceramic substrates for drawing-defined power conversion and new-energy module assemblies.
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Silicon Nitride AMB Copper-Clad Substrates
Si3N4 AMB copper-clad substrates positioned for high-reliability power modules and repeated thermal cycling.
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Alumina AMB Copper-Clad Substrates
Alumina-based AMB copper-clad substrates for selected power-electronics layouts subject to ceramic and braze-system review.
View productProduct Advantages
- Active-metal brazing joins copper and ceramic in an integrated circuit carrier.
- Copper layers provide current paths, attachment pads and heat-spreading areas.
- Ceramic selection balances heat conduction, electrical insulation and resistance to mechanical stress.
- Defined copper distribution and layer geometry support power-module assembly and thermal-cycle evaluation.
Typical Applications
Copper circuits and ceramic insulation support the electrical and thermal paths in power assemblies.
- EV Traction Inverters
- SiC Power Modules
- Automotive Inverters
- High-Reliability Power Modules
Technical Data
Construction Parameters
AMB Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | Si3N4, AlN or alumina | Material-specific ceramic / braze stack |
| Si3N4 thickness | 0.25 / 0.32 mm | Si₃N₄ ceramic layer |
| Copper thickness | 0.30 / 0.40 / 0.50 / 0.80 mm | Selected AMB layer combinations |
| Pattern | Custom power circuit | Drawing review required |
| Surface finish | Bare Cu and selected plated finishes | Assembly-process dependent |
Construction Selection
Ceramic, Copper & Interfaces
| Element | Function | Construction definition |
|---|---|---|
| Ceramic | Electrical insulation and heat path | Material grade, thickness and functional surface |
| Copper | Current paths, attachment and heat spreading | Top / bottom thickness, pattern and isolation gaps |
| Interface and finish | Copper attachment and subsequent assembly | Braze system, copper coverage and attachment finish |
| Thermal / electrical assessment | Performance of the complete stack | Layer geometry, test method, operating conditions and interfaces |
Product configuration
Processing & Configuration
Processing defines the conductor geometry and the surfaces used in assembly.
- Ceramic / braze selection
- Copper joining
- Copper-pattern definition
- Top / bottom copper layouts
- Attachment-surface finish
- Individual units or master cards
- Custom circuit artwork
- Single- or double-sided copper
- Selected asymmetric configurations
- Bare or plated copper finishes
- Electrical and bond testing to agreed criteria
Configuration Scope
AMB configurations reviewed by drawing.
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Si3N4 AMB Substrates
- Selected AlN AMB Substrates
- Selected Alumina AMB Substrates
- Custom Thick-Copper Power Circuits
Quality & Inspection
Inspect both ceramic and metallization.
Inspection and documentation are available on request and defined during quotation.
- Ceramic and copper thickness
- Pattern dimensions and isolation gaps
- Flatness / bending
- Surface-finish thickness
- Visual and electrical inspection
- Bond, peel or braze-integrity tests when specified
Ordering Information
MOQ and typical lead time.
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
5 pieces or one master-card equivalent
AMB
6-10 weeks
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Can multiple ceramic bases be used?
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
What determines circuit line and isolation-gap dimensions?
Copper thickness, braze system, pattern coverage and electrical clearance define the joined circuit geometry.
What information is required for quotation?
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
Packaging & Shipping
Protect patterns, finishes and ceramic edges.
Packaging is selected for master cards, individual units and copper surface condition.
- Individual separation
- Anti-scratch surface protection
- Rigid trays or master-card frames
- Copper corrosion protection where appropriate
- Inner box and export carton
- Wooden case when required
What to Specify for RFQ
Provide the complete ceramic and circuit definition.
Metallized substrates require more than an outline drawing.
- DBC, DPC, AMB or other route
- Ceramic base and grade
- Ceramic thickness
- Copper / metal thickness
- Circuit drawing / Gerber / DXF
- Minimum line and isolation gap
- Surface finish
- Flatness / warpage
- Electrical / bond tests
- Quantity and delivery target
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.