AMB Product Family
Active-metal-brazed ceramic substrate systems for thick-copper power modules, severe thermal cycling and high mechanical reliability.
Product Family Portfolio
Select a product route for detailed application and drawing-review guidance.
5 products
AMB Ceramic Substrate Products
AlN-based AMB copper-clad substrates for power circuits requiring high heat transfer and robust metal-ceramic integration.
Typical application directions
Power Modules · Thermal Management
View Product DetailsAMB Ceramic Substrate Products
Si3N4 AMB substrates for SiC power modules requiring high mechanical reliability and severe thermal cycling.
Typical application directions
SiC Power Modules · EV Traction Inverters
View Product DetailsAMB Ceramic Substrate Products
AMB copper-clad ceramic substrates for drawing-defined power conversion and new-energy module assemblies.
Typical application directions
New-Energy Power Systems · Power Conversion
View Product DetailsAMB Ceramic Substrate Products
Si3N4 AMB copper-clad substrates positioned for high-reliability power modules and repeated thermal cycling.
Typical application directions
Automotive Inverters · High-Reliability Power Modules
View Product DetailsAMB Ceramic Substrate Products
Alumina-based AMB copper-clad substrates for selected power-electronics layouts subject to ceramic and braze-system review.
Typical application directions
Industrial Power Modules · Power Electronics
View Product DetailsAMB Technology
Active-metal braze joins thick copper to Si3N4 or selected AlN ceramics.
High-reliability power modules
Active-metal braze joins thick copper to Si3N4 or selected AlN ceramics.
Additional Metallization Options
These technologies remain distinct from DBC, DPC and AMB.
AMB Specifications
Size, asymmetric copper, warpage and special patterns require drawing review.
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | Si3N4; selected AlN | Grade and route dependent |
| Si3N4 thickness | 0.25 / 0.32 mm reference | Selected power grades |
| Copper thickness | 0.30 / 0.40 / 0.50 / 0.80 mm | Configuration dependent |
| Pattern | Custom power circuit | Drawing review required |
| Surface finish | Bare Cu and selected plated finishes | Assembly-process dependent |
Configuration Scope
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
Typical Applications
Application examples guide initial selection; final construction and acceptance criteria follow drawing review.
Technology Selection
Use this comparison for early routing; final selection follows circuit and assembly review.
| Factor | DBC | DPC | AMB |
|---|---|---|---|
| Typical ceramic | 96% Al2O3 or AlN | 96% / 99.6% Al2O3 or AlN | Si3N4; selected AlN |
| Copper system | Direct-bonded foil | Seed layer plus plated copper | Active-metal braze plus copper |
| Copper positioning | Thick / high current | Thin-to-medium controlled | Thick / robust power |
| Circuit precision | Medium | High | Medium |
| Thermal performance | Strong | Good for localized heat | Strong system performance |
| Mechanical reliability | Good; layout dependent | Precision/light-copper circuits | Highest severe-cycle position |
| Power electronics | High | Low–medium | Very high |
| Automotive | Medium–high | Selected electronics | Very high |
| Fine circuits | Medium | High | Low–medium |
Custom Manufacturing
The quote combines ceramic, copper, layout, finish and assembly requirements.
Quality & Inspection
Inspection and documentation are available on request and defined during quotation.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
Ordering Information
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
5 pieces or one master-card equivalent
AMB
6-10 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
Choose DBC for established thick-copper power circuits, DPC for fine controlled plated circuits and AMB for severe thermal cycling and high mechanical reliability.
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
No. They are starting references. Copper thickness, geometry, panel utilization and process route control feasibility.
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
What to Specify for RFQ
Metallized substrates require more than an outline drawing.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.