Material-Specific Product Family
High-thermal-conductivity AlN substrates for electrically insulating heat transfer in power electronics, optoelectronics and semiconductor packaging.
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Product Family Portfolio
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7 products
Aluminum Nitride Ceramic Substrate Products
Bare and drawing-processed AlN substrates for electrically insulated heat spreading in power and optoelectronic assemblies.
Typical application directions
Power Electronics · Thermal Management
View Product DetailsAluminum Nitride Ceramic Substrate Products
AlN substrates prepared for thick-film circuit processing where thermal management and electrical insulation are required.
Typical application directions
Thick-Film Circuits · Hybrid Microelectronics
View Product DetailsAluminum Nitride Ceramic Substrate Products
Double-sided polished AlN substrates for precision thin-film, optical and microelectronic assembly processes.
Typical application directions
Thin-Film Circuits · Optoelectronic Packaging
View Product DetailsAluminum Nitride Ceramic Substrate Products
Surface-controlled AlN substrates for thin-film circuits and compact high-heat-flux electronic packages.
Typical application directions
Thin-Film Circuits · High-Heat-Flux Electronics
View Product DetailsAluminum Nitride Ceramic Substrate Products
AlN substrates for electrically insulated heat transfer in IGBT power-module assemblies.
Typical application directions
IGBT Power Modules · Power Inverters
View Product DetailsAluminum Nitride Ceramic Substrate Products
AlN substrates with drawing-defined laser outlines, holes and precision features for electronic assembly.
Typical application directions
Precision Electronic Packaging · Custom Circuits
View Product DetailsThermal Conductivity Options
Thermal conductivity varies with grade and formulation. Higher-conductivity options are selected when thermal modeling justifies them.
About 170 W/m·K typical
A high-conductivity electrically insulating substrate for mainstream thermal-management designs.
200–230 W/m·K class
Optional grades for applications requiring lower ceramic thermal resistance.
Processing Capabilities
Geometry and finish are reviewed against thickness, thermal-conductivity grade and downstream metallization.
Typical Properties
Values are typical references and depend on grade and test method.
| Property | Website reference | Condition |
|---|---|---|
| Density | 3.26–3.33 g/cm³ typical | Grade dependent |
| Flexural strength | 330–450 MPa typical | Method and grade dependent |
| Thermal conductivity | 170 W/m·K typical standard grade | Higher-conductivity 200–230 W/m·K class options |
| CTE | 4.5–4.7 × 10⁻⁶/K typical | Temperature range dependent |
| Dielectric constant | About 8.5–9.0 at 1 MHz | Grade and method dependent |
| Volume resistivity | ≥10¹³ Ω·cm typical | At room temperature |
| Dielectric strength | >15 kV/mm typical | Depends on thickness and test method |
Available Specifications
Dimensions, tolerances and surface requirements depend on grade, thickness and processing.
| Item | Website reference | Condition |
|---|---|---|
| Thickness | 0.38–1.5 mm standard commercial range | Not every size and grade combination |
| Size | 50.8–127 mm square standard references; approximately 140 × 190 mm by review | Subject to grade and drawing review |
| Dimensional tolerance | ±0.2 mm standard reference | Tighter tolerances may be available |
| Flatness / warpage | ≤0.2% of length general reference | Depends on dimensions and thickness |
| Surface roughness | As-fired Ra typically 0.2–0.6 µm | Lapped and polished surfaces available |
| Processing | Cutting, drilling, scribing, lapping, polishing and metallization | Subject to drawing review |
Product Solutions
Product forms are quoted to drawing without implying a separate SKU page.
Applications
AlN retains electrical insulation while reducing thermal resistance through the ceramic layer compared with alumina.
Selection Guidance
Choose by thermal resistance, assembly process and mechanical duty rather than treating AlN as simply a better alumina.
| Priority | Recommended direction | Why |
|---|---|---|
| Cost and mature processing | Alumina | Established and economical |
| Highest bulk thermal conductivity | Aluminum Nitride | Efficient electrically insulating heat path |
| Severe thermal cycling and toughness | Silicon Nitride | Higher fracture toughness and reliability |
Custom Manufacturing
Custom outlines and surfaces are reviewed with the grade and assembly process.
Quality & Inspection
Inspection and documentation are agreed during quotation and available on request.
Packaging & Shipping
AlN substrates receive individual separation and surface protection appropriate to the finish.
Ordering Information
Typical lead times depend on grade availability, drawing, quantity, processing and inspection requirements.
Recommended MOQ
5 pieces
Bare substrates
3–5 weeks
Precision processing
4–6 weeks
Metallized
5–9 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
No. The standard website position is about 170 W/m·K typical. The 200–230 W/m·K class describes optional higher-conductivity grades.
Choose AlN when heat must pass through an electrically insulating ceramic with substantially lower thermal resistance.
Yes. Geometry, chipping criteria, thickness and surface requirements are reviewed together.
Recommended MOQ is 5 pieces. Typical lead time is 3–5 weeks bare, 4–6 weeks precision processed and 5–9 weeks metallized, depending on specification and quantity.
Material reference
Review AlN material properties and selection context separately from the product-family offer.
What to Specify for RFQ
Thermal-conductivity class and surface condition are essential to a useful AlN quotation.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.