Aluminum Nitride Ceramic Substrates
Bare and drawing-processed AlN substrates for electrically insulated heat spreading in power and optoelectronic assemblies.
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Material-Specific Product Family
Aluminum Nitride (AlN) Ceramic Substrates
Aluminum nitride ceramic substrates combine electrical insulation with heat conduction in power-electronic, optoelectronic and circuit assemblies.
Product Description
Aluminum nitride ceramic substrates combine electrical insulation with heat conduction in power-electronic, optoelectronic and circuit assemblies. The bare ceramic carries heat toward the mounting interface while supporting the subsequent conductor or attachment layers.
Standard blanks, polished surfaces and laser-processed outlines are different delivery formats of the ceramic carrier. Substrate thickness, contact interfaces and the conductor stack all contribute to the assembly's thermal resistance.
Material & Process Filter
Filter compatible substrate processes.
Only technically compatible routes are shown. Select one or more processes to compare matching products; clear the selection to return to the base-material portfolio.
Product Family Portfolio
Aluminum Nitride Ceramic Substrate Products
Select a product route for detailed application and drawing-review guidance.
7 products
Aluminum Nitride Ceramic Substrates for Thick-Film Circuits
AlN substrates prepared for thick-film circuit processing where thermal management and electrical insulation are required.
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Double-Sided Polished AlN Ceramic Substrates
Double-sided polished AlN substrates for precision thin-film, optical and microelectronic assembly processes.
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AlN Ceramic Substrates for Thin-Film Circuits
Surface-controlled AlN substrates for thin-film circuits and compact high-heat-flux electronic packages.
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Aluminum Nitride Ceramic Substrates for IGBT Power Modules
AlN substrates for electrically insulated heat transfer in IGBT power-module assemblies.
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Laser Precision-Machined Aluminum Nitride Substrates
AlN substrates with drawing-defined laser outlines, holes and precision features for electronic assembly.
View productProduct Advantages
- An electrically insulating ceramic heat path supports compact power and optoelectronic layouts.
- Material conductivity and ceramic thickness can be selected together for the thermal design.
- Lapped or polished functional faces support the selected film, bonding or attachment process.
- Drawing-defined holes, slots and outlines position the substrate within the package.
Typical Applications
AlN retains electrical insulation while reducing thermal resistance through the ceramic layer compared with alumina.
- IGBT Modules
- MOSFET Modules
- SiC Power Modules
- GaN Power Devices
- High-Power LEDs
- Laser Diodes
- RF / Microwave Electronics
- Semiconductor Packaging
- EV Power Electronics
- Industrial Inverters
- Thermal Management
Technical Data
Typical Material Selection Data
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Dimensions & Processing
Substrate Geometry & Surface
| Feature | Specification basis |
|---|---|
| Outline and thickness | Length × width × thickness; drawing-defined shape |
| Holes, slots and scribe patterns | Feature size, position, edge distance and residual thickness for scribing |
| Surface state | As-fired, lapped or polished; functional faces and roughness |
| Geometrical control | Thickness variation, flatness, warpage and measurement support |
| Edges and downstream processing | Edge/chipping criteria and the film, bonding or metallization process |
Material Selection
Match conductivity to the thermal design.
The required thermal path, thickness and downstream circuit process establish the conductivity class and surface specification.
Electrically insulating heat path
Bare AlN Substrates
A ceramic base for applications combining heat transfer and electrical isolation.
- Conductivity class
- Thickness and interface resistance
Drawing-defined outlines and surfaces
Processed AlN Substrates
Specify holes, slots, scribe lines and finish around assembly requirements.
- Feature layout and edges
- Lapped or polished functional surfaces
Selection Guidance
AlN is an independent thermal substrate platform.
Choose by thermal resistance, assembly process and mechanical duty rather than treating AlN as simply a better alumina.
| Priority | Recommended direction | Why |
|---|---|---|
| Cost and mature processing | Alumina | Established and economical |
| Highest bulk thermal conductivity | Aluminum Nitride | Efficient electrically insulating heat path |
| Severe thermal cycling and toughness | Silicon Nitride | Higher fracture toughness and reliability |
Product configuration
Processing & Configuration
Geometry and finish are reviewed against thickness, thermal-conductivity grade and downstream metallization.
- Laser Cutting
- Laser Drilling
- Laser Scribing
- Grinding
- Lapping
- Polishing
- Metallization
- Custom Geometry
- Custom laser-cut outlines
- Holes, slots and scribe lines
- Grinding and thickness control
- Lapped and polished surfaces
- DPC, DBC/AMB, thick-film and thin-film options
- Drawing-based inspection
Product Solutions
Bare, processed and metallization-ready AlN substrates.
Configurations are reviewed against the drawing and delivery condition.
- Standard AlN Substrates
- Higher-Conductivity AlN Substrates
- Laser-Processed AlN Substrates
- Polished AlN Substrates
- Metallization-Ready AlN Substrates
Quality & Inspection
Verify the substrate features that control assembly.
Inspection and documentation are agreed during quotation and available on request.
- Grade and thermal-conductivity review
- Dimensions and thickness
- Flatness and warpage
- Surface roughness and visual inspection
- Laser feature and hole position
- Metallization inspection
Material reference
Review AlN material properties and selection context separately from the product-family offer.
Ordering Information
MOQ and typical lead time.
Price and delivery are provided for the specified enquiry; prototype and production quantities can be stated separately.
Recommended MOQ
By quotation
Quotation inputs
Drawing, material, finish, quantity and delivery destination
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Is a bare ceramic substrate the same as a ceramic PCB?
No. A bare substrate is the insulating ceramic base. A ceramic circuit board includes a conductor pattern and may include metallization, vias or assembly features. Specify whether the enquiry concerns bare ceramic, a metallized blank or a finished circuit.
Which dimensions and finish should I specify?
Include length, width, thickness, outline, hole or scribe pattern, critical tolerances, flatness and roughness. Identify the functional faces and the downstream film, bonding or metallization process.
How do I choose an AlN conductivity class?
Start from the thermal-resistance target, thickness and interfaces. A higher conductivity number is only one part of the thermal design; use grade-specific values at the relevant temperature.
When are price and delivery established?
Send the drawing, material and surface requirements, quantity and delivery destination. The quotation can then address the actual product and order rather than a generic website price or schedule.
Packaging & Shipping
Protect AlN edges and prepared surfaces.
AlN substrates receive individual separation and surface protection appropriate to the finish.
- Individual separation
- Anti-scratch interlayers
- Rigid trays or foam protection
- Moisture protection where appropriate
- Inner box and export carton
- Wooden case when required
What to Specify for RFQ
Define the grade, geometry and assembly requirements.
Thermal-conductivity class and surface condition are essential to a useful AlN quotation.
- Thermal-conductivity class
- Length × width × thickness
- Drawing and quantity
- Tolerance and flatness
- Surface finish / roughness
- Hole and scribing pattern
- Metallization stack
- Operating environment
- Inspection and packaging
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.