DBC Product Family
Direct-bonded copper ceramic substrates for established thick-copper, high-current power circuits and thermal-management assemblies.
Product Family Portfolio
Select a product route for detailed application and drawing-review guidance.
5 products
DBC Ceramic Substrate Products
AlN DBC substrates for thermoelectric modules requiring thick copper, electrical insulation and efficient heat transfer.
Typical application directions
Thermoelectric Modules · Power Electronics
View Product DetailsDBC Ceramic Substrate Products
Double-sided DBC ceramic substrates for established high-current power layouts and thermal-management assemblies.
Typical application directions
Power Modules · Industrial Drives
View Product DetailsDBC Ceramic Substrate Products
DBC substrates for thick-film power circuits requiring robust bonded copper and electrical insulation.
Typical application directions
Thick-Film Power Circuits · Hybrid Electronics
View Product DetailsDBC Ceramic Substrate Products
AlN DBC substrates for high-current circuits where bulk heat transfer and electrical insulation are primary constraints.
Typical application directions
IGBT Modules · Power Inverters
View Product DetailsDBC Ceramic Substrate Products
Alumina DBC substrates for mature thick-copper power circuits and cost-balanced electronic assemblies.
Typical application directions
Industrial Power Modules · Motor Drives
View Product DetailsDBC Technology
Copper foil bonded to alumina or AlN for high-current, thermally robust circuits.
Thick-copper power circuits
Copper foil bonded to alumina or AlN for high-current, thermally robust circuits.
Additional Metallization Options
These technologies remain distinct from DBC, DPC and AMB.
DBC Specifications
Line/space and overall size depend on copper thickness, ceramic and circuit geometry.
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | 96% Al2O3 or AlN | Route dependent |
| Ceramic thickness | 0.25–1.0 mm reference | Selected combinations |
| Copper thickness | 0.10–0.30 mm | Other combinations on request |
| Line / space | 0.30 / 0.30 mm conservative starting reference | Depends on copper thickness and geometry |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Available to agreed specification | Test method and geometry must be defined |
Configuration Scope
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
Typical Applications
Application examples guide initial selection; final construction and acceptance criteria follow drawing review.
Technology Selection
Use this comparison for early routing; final selection follows circuit and assembly review.
| Factor | DBC | DPC | AMB |
|---|---|---|---|
| Typical ceramic | 96% Al2O3 or AlN | 96% / 99.6% Al2O3 or AlN | Si3N4; selected AlN |
| Copper system | Direct-bonded foil | Seed layer plus plated copper | Active-metal braze plus copper |
| Copper positioning | Thick / high current | Thin-to-medium controlled | Thick / robust power |
| Circuit precision | Medium | High | Medium |
| Thermal performance | Strong | Good for localized heat | Strong system performance |
| Mechanical reliability | Good; layout dependent | Precision/light-copper circuits | Highest severe-cycle position |
| Power electronics | High | Low–medium | Very high |
| Automotive | Medium–high | Selected electronics | Very high |
| Fine circuits | Medium | High | Low–medium |
Custom Manufacturing
The quote combines ceramic, copper, layout, finish and assembly requirements.
Quality & Inspection
Inspection and documentation are available on request and defined during quotation.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
Ordering Information
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
5 pieces or one master-card equivalent
DBC
5-9 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
Choose DBC for established thick-copper power circuits, DPC for fine controlled plated circuits and AMB for severe thermal cycling and high mechanical reliability.
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
No. They are starting references. Copper thickness, geometry, panel utilization and process route control feasibility.
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
What to Specify for RFQ
Metallized substrates require more than an outline drawing.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.