AlN Copper-Clad DBC Substrates for Thermoelectric Modules
AlN DBC substrates for thermoelectric modules requiring thick copper, electrical insulation and efficient heat transfer.
View productBrowse Product Categories
DBC Product Family
DBC Direct-Bonded Copper Ceramic Substrates
DBC ceramic substrates bond copper foil to an alumina or aluminum nitride insulating layer.
Product Description
DBC ceramic substrates bond copper foil to an alumina or aluminum nitride insulating layer. The copper forms current paths and attachment surfaces, while the ceramic separates the circuit electrically from its mounting structure.
Single- and double-sided copper layouts combine current carrying with heat spreading. Ceramic thickness, copper thickness and the etched geometry define the finished stack; alumina and AlN thickness groups remain distinct.
Product Family Portfolio
DBC Ceramic Substrate Products
Select a product route for detailed application and drawing-review guidance.
5 products
Double-Sided Copper-Clad DBC Substrates
Double-sided DBC ceramic substrates for established high-current power layouts and thermal-management assemblies.
View product
Direct-Bonded Copper Substrates for Thick-Film Circuits
DBC substrates for thick-film power circuits requiring robust bonded copper and electrical insulation.
View product
Direct-Bonded Copper DBC Metallized AlN Substrates
AlN DBC substrates for high-current circuits where bulk heat transfer and electrical insulation are primary constraints.
View product
Direct-Bonded Copper DBC Metallized Alumina Substrates
Alumina DBC substrates for mature thick-copper power circuits and cost-balanced electronic assemblies.
View productProduct Advantages
- Bonded copper foil provides current-carrying paths, attachment pads and lateral heat spreading.
- The ceramic layer provides electrical isolation and mechanical support within the joined substrate.
- Alumina and AlN bases offer different material and heat-flow choices without changing the DBC process identity.
- Single- or double-sided patterns adapt the conductor layout to the module and cooling interface.
Typical Applications
Copper circuits and ceramic insulation support the electrical and thermal paths in power assemblies.
- IGBT Power Modules
- MOSFET Power Modules
- Industrial Drives
- Power Inverters
Technical Data
Construction Parameters
DBC Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% Al2O3 or AlN | Route dependent |
| Ceramic thickness | Alumina: 0.25–1.00 mm; AlN: 0.25–1.50 mm | Matched ceramic / copper stack |
| Copper thickness | 0.10–0.30 mm | Copper thickness and ceramic stack selected together |
| Line / space | Etched-pattern dependent | Copper thickness, etch profile and insulation clearance |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Construction-specific test | Peel method, coupon geometry and acceptance criterion |
Construction Selection
Ceramic, Copper & Interfaces
| Element | Function | Construction definition |
|---|---|---|
| Ceramic | Electrical insulation and heat path | Material grade, thickness and functional surface |
| Copper | Current paths, attachment and heat spreading | Top / bottom thickness, pattern and isolation gaps |
| Interface and finish | Copper attachment and subsequent assembly | Bonded interface, etched profile and attachment finish |
| Thermal / electrical assessment | Performance of the complete stack | Layer geometry, test method, operating conditions and interfaces |
Product configuration
Processing & Configuration
Processing defines the conductor geometry and the surfaces used in assembly.
- Copper / ceramic bonding
- Pattern etching
- Top / bottom copper layouts
- Attachment-surface finish
- Individual units or master cards
- Custom circuit artwork
- Single- or double-sided copper
- Selected asymmetric configurations
- Bare or plated copper finishes
- Electrical and bond testing to agreed criteria
Configuration Scope
DBC configurations reviewed by drawing.
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Alumina DBC Substrates
- Aluminum Nitride DBC Substrates
- Single- and Double-Sided Copper
- Custom Thick-Copper Circuits
Quality & Inspection
Inspect both ceramic and metallization.
Inspection and documentation are available on request and defined during quotation.
- Ceramic and copper thickness
- Pattern dimensions and isolation gaps
- Flatness / bending
- Surface-finish thickness
- Visual and electrical inspection
- Bond, peel or braze-integrity tests when specified
Ordering Information
MOQ and typical lead time.
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
5 pieces or one master-card equivalent
DBC
5-9 weeks
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Can multiple ceramic bases be used?
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
What determines circuit line and isolation-gap dimensions?
Copper thickness, etch profile and required electrical clearance establish the conductor and isolation-gap geometry.
What information is required for quotation?
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
Packaging & Shipping
Protect patterns, finishes and ceramic edges.
Packaging is selected for master cards, individual units and copper surface condition.
- Individual separation
- Anti-scratch surface protection
- Rigid trays or master-card frames
- Copper corrosion protection where appropriate
- Inner box and export carton
- Wooden case when required
What to Specify for RFQ
Provide the complete ceramic and circuit definition.
Metallized substrates require more than an outline drawing.
- DBC, DPC, AMB or other route
- Ceramic base and grade
- Ceramic thickness
- Copper / metal thickness
- Circuit drawing / Gerber / DXF
- Minimum line and isolation gap
- Surface finish
- Flatness / warpage
- Electrical / bond tests
- Quantity and delivery target
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.