Double-Sided Copper-Clad DPC Metallized Substrates
Double-sided DPC substrates for compact circuit layouts and controlled plated-copper integration.
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DPC Product Family
DPC Direct-Plated Copper Ceramic Substrates
DPC ceramic substrates carry patterned plated copper on an insulating alumina or aluminum nitride base.
Product Description
DPC ceramic substrates carry patterned plated copper on an insulating alumina or aluminum nitride base. Seed-layer deposition, photolithography and copper plating form conductors and connection pads for compact electronic packages.
Copper thickness, line spacing and plating distribution are linked features of one circuit layout. Double-sided copper and plated through-connections are separate options; a via requires its own defined hole and metallization construction.
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DPC Ceramic Substrate Products
Select a product route for detailed application and drawing-review guidance.
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DPC Metallized Substrates for Thin-Film Circuits
Fine-pattern DPC substrates for precision electronic packages, with conductor-stack review to distinguish plated copper from other thin-film systems.
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Direct-Plated Copper DPC Metallized AlN Substrates
AlN DPC substrates combining controlled plated copper with an electrically insulating thermal path.
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Direct-Plated Copper DPC Metallized Alumina Substrates
Alumina DPC substrates for fine copper patterns, electronic packaging and drawing-defined circuit layouts.
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DPC Metallized Substrates for Cooling Chips
DPC metallized ceramic substrates for thermoelectric cooling-chip circuits and compact heat-management assemblies.
View productProduct Advantages
- Photolithographic patterning forms copper traces and pads around the package layout.
- Controlled plated copper supports the selected conductor thickness and attachment surface.
- The ceramic carrier combines electrical isolation, support and a heat path beneath the circuitry.
- Surface-finish selection links the copper pads to the intended soldering, bonding or attachment process.
Typical Applications
Patterned pads and conductors support compact optical, electronic and sensor packages.
- LED and Laser Packaging
- LiDAR Modules
- Optical Communication
- RF and Sensor Packages
Technical Data
Construction Parameters
DPC Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% / 99.6% Al2O3 or AlN | Surface preparation dependent |
| Copper thickness | 10–130 µm | Plated thickness and pattern evaluated together |
| Line / space | Layout-dependent | Copper thickness, plating distribution and pattern geometry |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au or Ag examples | Finish stack matched to the attachment process |
Construction Selection
Ceramic, Copper & Interfaces
| Element | Function | Construction definition |
|---|---|---|
| Ceramic | Electrical insulation and heat path | Material grade, thickness and functional surface |
| Copper | Current paths, attachment and heat spreading | Top / bottom thickness, pattern and isolation gaps |
| Interface and finish | Copper attachment and subsequent assembly | Seed / plated layers, distribution and attachment finish |
| Thermal / electrical assessment | Performance of the complete stack | Layer geometry, test method, operating conditions and interfaces |
Product configuration
Processing & Configuration
Processing defines the conductor geometry and the surfaces used in assembly.
- Seed-layer preparation
- Photolithographic patterning
- Copper plating
- Defined hole / via construction
- Attachment-surface finish
- Individual units or master cards
- Custom circuit artwork
- Single- or double-sided copper
- Selected asymmetric configurations
- Bare or plated copper finishes
- Electrical and bond testing to agreed criteria
Configuration Scope
DPC configurations reviewed by drawing.
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Alumina DPC Substrates
- Aluminum Nitride DPC Substrates
- Single- and Double-Sided Circuits
- Fine-Pattern Plated Copper
Quality & Inspection
Inspect both ceramic and metallization.
Inspection and documentation are available on request and defined during quotation.
- Ceramic and copper thickness
- Pattern dimensions and isolation gaps
- Flatness / bending
- Surface-finish thickness
- Visual and electrical inspection
- Bond, peel or braze-integrity tests when specified
Ordering Information
MOQ and typical lead time.
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
10 pieces or one master-card equivalent
DPC
5-8 weeks
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Can multiple ceramic bases be used?
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
What determines circuit line and isolation-gap dimensions?
Copper thickness, plating distribution, feature registration and the pattern geometry are specified together.
What information is required for quotation?
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
Packaging & Shipping
Protect patterns, finishes and ceramic edges.
Packaging is selected for master cards, individual units and copper surface condition.
- Individual separation
- Anti-scratch surface protection
- Rigid trays or master-card frames
- Copper corrosion protection where appropriate
- Inner box and export carton
- Wooden case when required
What to Specify for RFQ
Provide the complete ceramic and circuit definition.
Metallized substrates require more than an outline drawing.
- DBC, DPC, AMB or other route
- Ceramic base and grade
- Ceramic thickness
- Copper / metal thickness
- Circuit drawing / Gerber / DXF
- Minimum line and isolation gap
- Surface finish
- Flatness / warpage
- Electrical / bond tests
- Quantity and delivery target
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.