DPC Product Family
Direct-plated copper ceramic substrates for fine circuit patterns, controlled copper thickness and precision electronic packaging.
Product Family Portfolio
Select a product route for detailed application and drawing-review guidance.
5 products
DPC Ceramic Substrate Products
Double-sided DPC substrates for compact circuit layouts and controlled plated-copper integration.
Typical application directions
Power and RF Packages · Microelectronics
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Fine-pattern DPC metallized substrates for thin-film circuits and precision electronic packages.
Typical application directions
Thin-Film Circuits · Precision Electronics
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AlN DPC substrates combining controlled plated copper with an electrically insulating thermal path.
Typical application directions
LED and Laser Packages · Power Electronics
View Product DetailsDPC Ceramic Substrate Products
Alumina DPC substrates for fine copper patterns, electronic packaging and drawing-defined circuit layouts.
Typical application directions
Electronic Packaging · RF and Sensor Modules
View Product DetailsDPC Ceramic Substrate Products
DPC metallized ceramic substrates for thermoelectric cooling-chip circuits and compact heat-management assemblies.
Typical application directions
Thermoelectric Cooling · Cooling Modules
View Product DetailsDPC Technology
Deposited seed layers, photolithography and copper plating for controlled fine patterns.
Fine plated circuits
Deposited seed layers, photolithography and copper plating for controlled fine patterns.
Additional Metallization Options
These technologies remain distinct from DBC, DPC and AMB.
DPC Specifications
Finer geometry remains subject to drawing and process review.
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | 96% / 99.6% Al2O3 or AlN | Surface preparation dependent |
| Copper thickness | 10–130 µm; 30–100 µm typical | Pattern dependent |
| Line / space | 0.10 / 0.10 mm website standard | Finer circuits subject to review |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au, Ag, AuSn and protection options | Assembly-process dependent |
Configuration Scope
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
Typical Applications
Application examples guide initial selection; final construction and acceptance criteria follow drawing review.
Technology Selection
Use this comparison for early routing; final selection follows circuit and assembly review.
| Factor | DBC | DPC | AMB |
|---|---|---|---|
| Typical ceramic | 96% Al2O3 or AlN | 96% / 99.6% Al2O3 or AlN | Si3N4; selected AlN |
| Copper system | Direct-bonded foil | Seed layer plus plated copper | Active-metal braze plus copper |
| Copper positioning | Thick / high current | Thin-to-medium controlled | Thick / robust power |
| Circuit precision | Medium | High | Medium |
| Thermal performance | Strong | Good for localized heat | Strong system performance |
| Mechanical reliability | Good; layout dependent | Precision/light-copper circuits | Highest severe-cycle position |
| Power electronics | High | Low–medium | Very high |
| Automotive | Medium–high | Selected electronics | Very high |
| Fine circuits | Medium | High | Low–medium |
Custom Manufacturing
The quote combines ceramic, copper, layout, finish and assembly requirements.
Quality & Inspection
Inspection and documentation are available on request and defined during quotation.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
Ordering Information
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements.
Recommended MOQ
10 pieces or one master-card equivalent
DPC
5-8 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
Choose DBC for established thick-copper power circuits, DPC for fine controlled plated circuits and AMB for severe thermal cycling and high mechanical reliability.
Yes. Alumina and AlN are common for DBC/DPC, while Si3N4 is the priority AMB base for high-reliability power modules.
No. They are starting references. Copper thickness, geometry, panel utilization and process route control feasibility.
Provide ceramic and copper thickness, metallization route, circuit file, finish, electrical or reliability criteria, quantity and assembly process.
What to Specify for RFQ
Metallized substrates require more than an outline drawing.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.