Silicon Carbide Trays
Silicon Carbide Ceramic Component
SKU: FWM/SC-TRAY-001
Product Configuration
Conceptual geometry guide; final configuration follows the approved drawing.
Carrier Tray
Representative form for drawing review.
Profiled Tray
Alternative geometry for application review.
- Material
- Silicon Carbide (SiC)
- Size
- Custom sizes available
- MOQ
- 5 pieces per type
- Applications
- Semiconductor
Silicon Carbide Trays (also known as SiC ceramic carrier trays or plates) are high-purity precision components designed for wafer handling and high-temperature processing in semiconductor and optoelectronics manufacturing.
Send drawing, dimensions, operating conditions and required quantity for material grade, surface requirements and inspection needs confirmation before quotation.
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Product Description
Review representative product forms and application context below. Final geometry and acceptance criteria are confirmed from the drawing and operating conditions.
Silicon Carbide Trays (also known as SiC ceramic carrier trays or plates) are high-purity precision components designed for wafer handling and high-temperature processing in semiconductor and optoelectronics manufacturing.
Made from high-purity silicon carbide, these trays deliver exceptional thermal stability, chemical inertness, high mechanical strength and excellent surface flatness. They are widely used as wafer carriers in ICP etching, epitaxial growth, annealing and CVD processes where contamination control and temperature uniformity are critical.
Manufacturing process (source record): High-purity SiC powder preparation → forming → high-temperature sintering → precision grinding and polishing → final inspection. (Specific process route and capability pending verification)
Quality control (source record): Dimensional inspection, surface flatness check, material property verification and batch traceability. (Specific QC standards and process pending confirmation)
Data status: the source record is not supplier-verified. Numerical values are typical engineering references, not guaranteed product specifications; final values require grade, drawing and test-basis confirmation.
Product Features
- Extreme temperature resistance (up to 1600–1650 °C)
- Superior chemical inertness against acids, alkalis and process gases
- High hardness and mechanical strength for long service life
- Excellent thermal conductivity for uniform heat distribution
- Precision surface flatness for accurate wafer positioning
- Low particle generation and non-contaminating surface
Typical Applications
- Wafer carriers for ICP etching and epitaxial growth
- High-temperature annealing and diffusion processes
- Semiconductor and microelectronics packaging
- Optoelectronics and LED manufacturing
- Power electronics and advanced device fabrication
Technical Data
| Property | Unit | SSiC | RBSiC | RSiC |
|---|---|---|---|---|
| Color | — | Black / dark gray | Black / dark gray | Black / dark gray |
| Bulk density | g/cm³ | ≥ 3.10 | ≥ 3.03 | 2.65 – 2.80 |
| Open porosity | % | < 0.2 | < 0.2 | < 16 |
| Hardness | HV0.5 | Approx. 2100 – 2600 | Approx. 2000 | Approx. 1800 – 2200 |
| Elastic modulus | GPa | Approx. 400 | Approx. 350 | Approx. 250 – 300 |
| Flexural strength at 25°C | MPa | ≥ 400 | ≥ 350 | 100 – 200 |
| Compressive strength at 25°C | MPa | ≥ 2200 | ≥ 2000 | ≥ 1500 |
| Thermal conductivity at 25°C | W/(m·K) | ≥ 110 | ≥ 90 | 80 – 120 |
| Coefficient of thermal expansion | 10⁻⁶/K | Approx. 4.0 | Approx. 4.0 | Approx. 4.0 – 4.5 |
| Maximum service temperature | °C | Up to 1650 | Up to 1300 – 1400 | Up to 1600 – 1650 |
Typical reference values for material selection only. Final specifications are confirmed against drawing, grade and operating conditions. Values shown are typical material data for reference and may vary with grade, geometry and test method. Final specifications should be confirmed against the drawing and operating conditions.
Available Forms
Representative forms are shown for selection. Send drawing, dimensions, operating conditions and required quantity for material grade, surface requirements and inspection needs confirmation before quotation.
- Flat trays / carrier plates
- Custom groove patterns and edge profiles
- Drawing-based designs evaluated for material route and manufacturing feasibility
Packaging & Shipping
Packing and shipment arrangements are selected for the confirmed component geometry and order requirements.
| Item | Details |
|---|---|
| Packaging | Individually protected, cushioned and packed in export cartons or wooden cases according to size, quantity and transport requirements |
| Payment terms | To be confirmed in the quotation |
| Port of shipment | China, subject to final order arrangement |
| Shipping options | Express courier, air freight, sea freight, or customer-appointed forwarder |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination
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