Silicon Carbide Trays and Carrier Plates
Silicon Carbide Ceramic Component
SKU: FWM/SC-TRAY-001
- Material
- Silicon Carbide (SiC)
- Size
- Custom sizes available
- MOQ
- 5 pieces per type
- Applications
- Semiconductor
Silicon carbide trays and carrier plates for wafer handling, precision support and thermal-process equipment.
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Product Description
Silicon carbide trays and carrier plates support and position workpieces during handling and thermal processing.
Flat surfaces, grooves and pockets locate the workpiece and establish its contact with the carrier. Silicon carbide's stiffness and low thermal expansion help preserve support geometry, while its thermal conductivity assists heat distribution through the carrier.
Product Features
- Thermal conductivity to help distribute heat through the carrier
- Low thermal expansion for stable positioning
- High stiffness for defined workpiece support
- Wear-resistant contact surfaces
- Flat, grooved and profiled carrier configurations
Typical Applications
- Wafer and workpiece carriers in thermal-process equipment
- Precision support trays for handling systems
- Semiconductor carrier plates with process-specific surface requirements
- Grooved and profiled workpiece support fixtures
Thermal SiC Route Properties
| Property | SSiC — sintered | SiSiC — silicon infiltrated | RSiC — recrystallized | Condition |
|---|---|---|---|---|
| SiC content (%) | >99 | >90 | >99 | — |
| Metallic silicon content (%) | — | 10 | — | — |
| Bulk density (g/cm³) | 3.1 | 3.1 | 2.7 | — |
| Open porosity (%) | <0.5 | <0.5 | 15 | — |
| Modulus of rupture (MPa) | 400 | 250 | 90 | Room temperature |
| Thermal conductivity (W/(m·K)) | 70 | 45 | 25 | — |
| Mean linear thermal expansion coefficient (10⁻⁶/K) | 4.0 | 4.5 | 4.8 | 20–1000°C |
| Typical maximum material temperature (°C) | 1600 | 1350 | 1650 | — |
Available Forms
Representative forms are shown for selection. Send drawing, dimensions, operating conditions and required quantity for material grade, surface requirements and inspection needs confirmation before quotation.
- Flat trays / carrier plates
- Custom groove patterns and edge profiles
- Drawing-based designs evaluated for material route and manufacturing feasibility
Packaging & Shipping
Packing and shipment arrangements are selected for the confirmed component geometry and order requirements.
| Item | Details |
|---|---|
| Packaging | Individually protected, cushioned and packed in export cartons or wooden cases according to size, quantity and transport requirements |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Port of shipment | China, subject to final order arrangement |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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