Silicon Nitride Ceramic Substrate Sheets
High-strength Si3N4 substrate sheets for reliability-focused power electronics and severe thermal-cycling applications.
View productBrowse Product Categories
Electronics & Power-Module Substrate Family
Silicon Nitride (Si3N4) Ceramic Substrates
Silicon nitride ceramic substrates are insulating sheets for power-electronic assemblies that combine heat transfer with mechanical loading.
Product Description
Silicon nitride ceramic substrates are insulating sheets for power-electronic assemblies that combine heat transfer with mechanical loading. Strength and fracture toughness support thin ceramic sections exposed to stress from mounting and bonded copper layers.
Bare sheets and copper-clad AMB substrates are different constructions. The material table describes the bare substrate profile; copper thickness, braze system and pattern define the joined AMB stack separately.
Material & Process Filter
Filter compatible substrate processes.
Only technically compatible routes are shown. Select one or more processes to compare matching products; clear the selection to return to the base-material portfolio.
Product Family Portfolio
Silicon Nitride Ceramic Substrate Products
Select a product route for detailed application and drawing-review guidance.
1 products
Product Advantages
- Mechanical strength and fracture toughness support thin ceramic carriers under assembly stress.
- Electrical insulation separates the circuit from its mounting and cooling structure.
- Heat conduction contributes to the path through the ceramic and its contact interfaces.
- Bare and AMB-oriented formats support subsequent copper bonding and circuit integration.
Typical Applications
Ceramic strength, heat flow and the complete module construction are considered together.
- EV Power Modules
- Automotive Inverters
- Traction Inverters
- IGBT Modules
- SiC Power Modules
- Industrial Power Modules
- Renewable Energy Converters
- Rail Traction
- High Thermal-Cycling Environments
Technical Data
Material Properties
Si₃N₄ Substrate (Sinalit) Properties
| Property | Sinalit — bare Si₃N₄ substrate | Conditions / ±10% measurement tolerance (except ref.) |
|---|---|---|
| Density (g/cm³) | ≥3.22 | DIN EN 993-1 |
| Bending strength (MPa) | ≥700 | — |
| Fracture toughness (MPa·m½) | ≥6.5 | Indentation-fracture method |
| Thermal conductivity (W/(m·K)) | 90 | Room temperature; DIN EN 821-2 |
| Coefficient of thermal expansion (10⁻⁶/K) | 3.3 (ref.) | 100–800°C; DIN 51045-1 |
| Dielectric strength (kV/mm) | ≥25 | 20°C; AC / DC; DIN EN 60243-1 |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Young’s modulus (GPa) | ≥280 | ASTM C1259-15 |
| Specific heat capacity (J/(g·K)) | ≥0.68 | 25°C; DIN EN 821-3 Method B |
| Relative permittivity | 7.8 (ref.) | Room temperature; 1 MHz; Ra ≤0.4 µm; ASTM D150 |
| Dielectric loss tangent | ≤0.003 | Room temperature; 1 MHz; Ra ≤0.4 µm; ASTM D150 |
Available Specifications
Thin substrate formats for power-module integration.
Dimensions, warpage and features are reviewed together with any copper layout.
| Item | Typical format | Condition |
|---|---|---|
| Standard thickness | 0.25 and 0.32 mm for AMB power substrates | Other thicknesses available by request |
| Sheet references | 110 × 110, 114.3 × 114.3 and approximately 138 × 190.5 mm | Subject to grade and drawing review |
| Dimensional tolerance | ±0.2 mm reference | Tighter values by review |
| Flatness / warpage | Controlled to drawing | Depends on size, thickness and copper layout |
| Surface | As-fired or prepared for AMB | Application dependent |
| Laser processing | Available | Subject to thickness, edge quality and drawing review |
Product Options
Bare and AMB-oriented Si3N4 substrate formats.
The selected power-substrate grade and thickness are reviewed against thermal resistance and module reliability.
Customer-controlled integration
Bare Si3N4 Substrates
High-reliability insulating substrates for custom processing or metallization.
- High strength
- Thermal-shock resistance
Power-module platform
AMB-Ready Si3N4 Substrates
Thin, tough ceramic substrates prepared for thick-copper active metal brazing.
- Thermal-cycle reliability
- Automotive power modules
Selection Guidance
Material Selection
Balance ceramic heat flow, mechanical loading and the intended copper process.
| Priority | Recommended direction | Selection reason |
|---|---|---|
| Maximum bulk thermal conductivity | Aluminum Nitride | Higher conductivity class |
| Cost-effective general substrate | Alumina | Mature and widely processed |
| Mechanical stress in bonded power substrates | Silicon Nitride | Strength and fracture toughness alongside heat transfer |
Product configuration
Processing & Configuration
Laser features and metallization depend on grade, thickness, edge quality and module layout.
- Custom Outlines
- Laser Processing
- Hole / Slot Features
- Surface Preparation
- AMB Metallization
- Patterned Copper
- Custom Geometry
- Custom ceramic outlines
- Laser features by review
- 0.25 / 0.32 mm AMB references
- Patterned thick copper
- Selected plated finishes
- Reliability and inspection requirements
Quality & Inspection
Control the features linked to module life.
Documentation and test scope are available on request and agreed before production.
- Material grade review
- Dimensions and thickness
- Flatness / warpage
- Surface and edge inspection
- Copper thickness and pattern inspection
- Braze integrity and agreed reliability tests
Material reference
Review material behavior separately from this electronics and power-module substrate offer.
Ordering Information
MOQ and typical lead time.
Typical lead times depend on selected grade, layout, copper configuration, quantity and qualification requirements.
Recommended MOQ
5 pieces
Bare substrates
4–7 weeks
AMB configurations
6–10 weeks
FAQ
Questions buyers commonly ask.
Practical sourcing questions for material selection, processing and ordering.
Why choose Si3N4 when AlN has higher thermal conductivity?
Silicon nitride combines heat transfer with strength and fracture toughness. Ceramic thickness, copper distribution, interfaces and operating cycles determine how those material properties contribute to a complete module.
Is this the same product as a thermocouple protection tube?
No. This page covers flat electronic and power-module substrates, not molten-metal thermocouple protection tubes.
Is AMB the primary metallization route?
AMB is the priority route for high-reliability Si3N4 power modules, subject to ceramic, copper and layout review.
What is the MOQ and lead time?
Recommended MOQ is 5 pieces. Bare substrates are typically 4–7 weeks and AMB configurations 6–10 weeks, depending on design and quantity.
Packaging & Shipping
Rigid separation for thin ceramic and finished copper.
Packaging protects ceramic edges and the selected copper finish.
- Individual part or master-card separation
- Rigid trays
- Surface-protection layers
- Corrosion protection for copper where appropriate
- Inner box and export carton
- Wooden case when required
What to Specify for RFQ
Describe the mechanical and thermal reliability duty.
Separate bare-substrate requirements from AMB circuit requirements.
- Si3N4 grade
- Bare or AMB format
- Ceramic thickness
- Copper thickness when applicable
- Outline and circuit drawing
- Flatness / warpage
- Surface finish
- Thermal-cycle requirement
- Quantity and inspection plan
Engineering RFQ
Tell us what the substrate must do.
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.