Electronics & Power-Module Substrate Family
High-strength Si3N4 substrates for power-electronic assemblies where fracture toughness, thermal shock and repeated thermal cycling drive reliability.
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Product Family Portfolio
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Silicon Nitride Ceramic Substrate Products
High-strength Si3N4 substrate sheets for reliability-focused power electronics and severe thermal-cycling applications.
Typical application directions
SiC Power Modules · Automotive Inverters
View Product DetailsProduct Options
The selected power-substrate grade and thickness are reviewed against thermal resistance and module reliability.
Customer-controlled integration
High-reliability insulating substrates for custom processing or metallization.
Power-module platform
Thin, tough ceramic substrates prepared for thick-copper active metal brazing.
Processing Capabilities
Laser features and metallization depend on grade, thickness, edge quality and module layout.
Typical Properties
Values refer to selected power-substrate grades and remain grade or method dependent where stated.
| Property | Website reference | Condition |
|---|---|---|
| Density | 3.2–3.3 g/cm³ typical | Grade dependent |
| Flexural strength | 650–800+ MPa | Grade and test-method dependent |
| Fracture toughness | ≥6 MPa·m½ | Selected power-substrate grades |
| Thermal conductivity | 80–90 W/m·K typical | Power-substrate grades |
| CTE | 2.6–3.2 × 10⁻⁶/K typical | Temperature-range dependent |
| Dielectric strength | ≥15 kV/mm reference | Thickness and method dependent |
| Volume resistivity | ≥10¹⁴ Ω·cm typical | At room temperature |
Available Specifications
Dimensions, warpage and features are reviewed together with any copper layout.
| Item | Website reference | Condition |
|---|---|---|
| Standard thickness | 0.25 and 0.32 mm for AMB power substrates | Other thicknesses available by request |
| Sheet references | 110 × 110, 114.3 × 114.3 and approximately 138 × 190.5 mm | Subject to grade and drawing review |
| Dimensional tolerance | ±0.2 mm reference | Tighter values by review |
| Flatness / warpage | Controlled to drawing | Depends on size, thickness and copper layout |
| Surface | As-fired or prepared for AMB | Application dependent |
| Laser processing | Available | Subject to thickness, edge quality and drawing review |
Applications
Si3N4 is selected when mechanical loading and thermal cycling matter more than maximum bulk thermal conductivity.
Selection Guidance
The design decision balances heat flow with mechanical and thermomechanical reliability.
| Priority | Recommended direction | Selection reason |
|---|---|---|
| Maximum bulk thermal conductivity | Aluminum Nitride | Higher conductivity class |
| Cost-effective general substrate | Alumina | Mature and widely processed |
| High toughness and thermal cycling | Silicon Nitride | Strong power-module reliability position |
Custom Manufacturing
Bare and AMB requirements are evaluated with the module drawing.
Quality & Inspection
Documentation and test scope are available on request and agreed before production.
Packaging & Shipping
Packaging protects ceramic edges and the selected copper finish.
Ordering Information
Typical lead times depend on selected grade, layout, copper configuration, quantity and qualification requirements.
Recommended MOQ
5 pieces
Bare substrates
4–7 weeks
AMB configurations
6–10 weeks
FAQ
Practical sourcing questions for material selection, processing and ordering.
Si3N4 combines useful heat transfer with substantially higher strength and fracture toughness, helping power modules withstand copper stress and repeated thermal cycling.
No. This page covers flat electronic and power-module substrates, not molten-metal thermocouple protection tubes.
AMB is the priority route for high-reliability Si3N4 power modules, subject to ceramic, copper and layout review.
Recommended MOQ is 5 pieces. Bare substrates are typically 4–7 weeks and AMB configurations 6–10 weeks, depending on design and quantity.
Material reference
Review material behavior separately from this electronics and power-module substrate offer.
What to Specify for RFQ
Separate bare-substrate requirements from AMB circuit requirements.
Engineering RFQ
Provide the drawing, dimensions, quantity and application requirements so the team can review material and processing options before quotation.