Boron Nitride Custom Components
Boron Nitride Ceramics Component
SKU: FWM/BN-CUSTOM-001
- Material
- Boron Nitride Ceramic Family
- Size
- Custom sizes available
- MOQ
- Pending Verification
- Applications
- High-Temperature Manufacturing
Custom boron nitride components selected by atmosphere, molten-material contact, insulation and drawing requirements.
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Product Description
Custom boron nitride components selected by atmosphere, molten-material contact, insulation and drawing requirements.
Custom boron nitride components are non-standard insulating, supporting and process-contact parts for thermal equipment and compatible molten-material systems.
Machinability allows several locating, insulating or flow-contact features to be combined in one component. BN formulation and service atmosphere determine the appropriate thermal and chemical duty.
Product Features
- Application-Specific BN Route
- Drawing-Based Customization
- Machinability
- Formulation options for the process environment
Typical Applications
- High-Temperature Manufacturing — Custom process and insulation components: Supports a tailored BN route after environment review.
- Molten-Material Processing — Custom contact and transfer components: Provides drawing-based geometry for low-wetting applications.
Product Geometry & Configuration
Hot-Pressed BN (AX05 / ZSBN) Properties
| Property / condition | AX05 — parallel / perpendicular to pressing | ZSBN — parallel / perpendicular to pressing |
|---|---|---|
| Crystalline phase | >99.5% hBN | >45% hBN; <45% ZrO₂; <10% borosilicate |
| Binder / bond | Self bonded | Borosilicate glass |
| Density (g/cm³) | 1.9 | 2.9 |
| Open porosity (%) | 19.3 | 1.1 |
| Flexural strength (MPa) — 25°C | 22 / 21 | 144 / 107 |
| Young’s modulus (GPa) — 25°C | 17 / 71 | 71 / 71 |
| Compressive strength (MPa) — 25°C | 25 / — | 219 / 254 |
| Knoop hardness (kg/mm²) | 4 | 100 |
| Thermal conductivity (W/(m·K)) — 25°C | 78 / 130 | 24 / 34 |
| Linear thermal expansion (10⁻⁶/K) — 25–400°C | −2.3 / −0.7 | 4.1 / 3.4 |
| Linear thermal expansion (10⁻⁶/K) — 400–800°C | −2.5 / 1.1 | 5.6 / 4.3 |
| Specific heat (J/(g·K)) — 25°C | 0.81 | 0.64 |
| Typical maximum material temperature, oxidizing (°C) | 850 | 850 |
| Typical maximum material temperature, inert (°C) | 2000 | 1600 |
| Relative permittivity — 1 MHz | 4.0 / 4.0 | 18 / 19 |
| Dielectric loss tangent — 1 MHz | 0.0012 / 0.0003 | 0.045 / 0.067 |
| Dielectric strength (kV/mm) | 79 | 3.5 |
| Volume resistivity (Ω·cm) — 25°C | >10¹³ / >10¹⁴ | >10¹³ / >10¹² |
Product Geometry & Configuration
| Product parameter | Configuration | Basis |
|---|---|---|
| Material system | Boron Nitride Ceramic Family | Material family; grade selected for the application |
| Component forms | Custom rings and sleeves; Custom nozzles and holders; Complex drawing-based components | Drawing-defined configurations |
| Geometry and dimensions | Custom sizes available | Part drawing and mating interfaces |
| Functional surfaces | Contact, locating, joining or insulating surfaces as applicable | Surface finish and acceptance criteria on the drawing |
Available Forms
Representative forms are shown for selection. Final geometry, material route, interface, finish and acceptance criteria require drawing review.
- Custom rings and sleeves
- Custom nozzles and holders
- Complex drawing-based components
Packaging & Shipping
Packing and shipment arrangements are selected for the confirmed component geometry and surface requirements.
| Item | Details |
|---|---|
| Product protection | Selected for geometry, surface condition and quantity |
| Other commercial terms and lead time | Confirmed in quotation |
| Source boundary | No competitor packaging or delivery promise is inherited. |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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