Custom Silicon Carbide Ceramic Components
Silicon Carbide Ceramic Component
SKU: FWM/SC-CUSTOM-001
- Material
- Silicon Carbide (SiC)
- Size
- Custom sizes available
- MOQ
- 5 pieces per type
- Applications
- Semiconductor
Custom silicon carbide rings, sleeves, plates, blocks and featured parts for wear, chemical-contact and thermal-process duties.
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Product Description
Custom silicon carbide components provide wear-contact surfaces, chemical-resistant interfaces and thermally stable supports in industrial equipment.
Drawing-based shapes include rings, sleeves, plates, blocks and parts with mounting or flow features. Silicon carbide's hardness helps resist abrasive wear, while its thermal conductivity and low thermal expansion are useful in components exposed to heat and temperature gradients.
Product Features
- High hardness for abrasive-wear surfaces
- Thermal conductivity for heat transfer
- Low thermal expansion for dimensional stability
- Chemical resistance for compatible process media
- Drawing-based shapes for component-specific interfaces
Typical Applications
- Wear and sealing components in pumps and process equipment
- Fixtures, guides and support parts in industrial machinery
- Drawing-based thermal-process components
- Ceramic handling and support components in semiconductor equipment
Dense SiC Typical Properties
| Property | SSiC — sintered | SiSiC / RBSiC — reaction bonded | Condition |
|---|---|---|---|
| Density (g/cm³) | ≥3.12 | ≥3.03 | — |
| Apparent porosity (%) | <0.2 | <0.2 | — |
| Vickers hardness (HV0.5) | 2100 | 2000 | 0.5 kgf test force |
| Young’s modulus (GPa) | 400 | 350 | — |
| Fracture toughness (MPa·m¹/²) | 4–5 | 2.5–3.5 | — |
| Flexural strength (MPa) | ≥400 | ≥350 | 25°C |
| Compressive strength (MPa) | ≥2200 | ≥2000 | 25°C |
| Thermal conductivity (W/(m·K)) | ≥110 | ≥90 | 25°C |
| Mean linear thermal expansion coefficient (10⁻⁶/K) | 4.0 | 4.0 | 25–1000°C |
| Typical maximum material temperature (°C) | 1650 | 1300 | — |
Available Forms
Representative custom SiC forms. Surface finish, radii and datum interfaces are specified for the contact, sealing or support function.
- Custom profiles with drawing-defined bores, shoulders and mating interfaces
Packaging & Shipping
Packing and shipment arrangements are selected for the confirmed component geometry and order requirements.
| Item | Details |
|---|---|
| Packaging & shipping | Clean packaging with protective liners to prevent scratches and contamination. Cartons palletized and secured for safe transit. |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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