Direct-Plated Copper DPC Metallized Alumina Substrates
Ceramic Substrate
SKU: FWM/CS-DPC-004
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
DPC Metallized Substrate
Representative substrate form for drawing review.
Fine-Pattern DPC Circuit
Processing route and features are confirmed during RFQ review.
- Material
- Ceramic / Plated Copper System
- Size
- Custom sizes by drawing
- MOQ
- 10 pieces or one master-card equivalent
- Applications
- Electronic Packaging
Alumina DPC substrates for fine copper patterns, electronic packaging and drawing-defined circuit layouts.
Metallized substrates require more than an outline drawing.
Browse Products
Alumina Ceramic Products
Zirconia Ceramic Products
Silicon Carbide Products
Silicon Nitride Products
Aluminum Nitride Products
Product Description
Review material position, substrate forms and processing scope.
Alumina DPC substrates for fine copper patterns, electronic packaging and drawing-defined circuit layouts.
Deposited seed layers, photolithography and copper plating for controlled fine patterns.
The quote combines ceramic, copper, layout, finish and assembly requirements.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- DPC — Direct Plated Copper
- 10–130 µm copper
- 0.10 / 0.10 mm standard line/space
Typical Applications
- Electronic Packaging
- RF and Sensor Modules
Technical Data
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | 96% / 99.6% Al2O3 or AlN | Surface preparation dependent |
| Copper thickness | 10–130 µm; 30–100 µm typical | Pattern dependent |
| Line / space | 0.10 / 0.10 mm website standard | Finer circuits subject to review |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au, Ag, AuSn and protection options | Assembly-process dependent |
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Alumina DPC Substrates
- Aluminum Nitride DPC Substrates
- Single- and Double-Sided Circuits
- Fine-Pattern Plated Copper
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 10 pieces or one master-card equivalent |
| Lead-time references | DPC: 5-8 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination