Alumina Direct-Plated Copper DPC Substrates
Ceramic Substrate
SKU: FWM/CS-DPC-004
- Material
- Ceramic / Plated Copper System
- Size
- Custom sizes by drawing
- MOQ
- 10 pieces or one master-card equivalent
- Applications
- Electronic Packaging
Alumina DPC substrates for fine copper patterns, electronic packaging and drawing-defined circuit layouts.
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Product Description
Alumina DPC substrates carry plated copper traces and pads on an electrically insulating alumina base.
Photolithographic patterning supports compact circuit layouts for electronic, RF and sensor packages. Copper thickness, conductor spacing and the chosen finish together define the circuit's physical construction.
Fine plated copper on alumina is illustrated. Purity, conductor geometry, copper thickness and surface finish are confirmed in the quotation.
Product Advantages
- Patterned copper provides circuit paths on an electrically insulating alumina base.
- Photolithographic pads connect compact devices to their package interfaces.
- Ceramic grade and copper construction can be selected as separate design variables.
Typical Applications
- Electronic Packaging: patterned copper and alumina insulation support compact component attachment.
- RF and Sensor Modules: plated traces and connection pads organize the specified circuit layout.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% or 99.6% alumina (Al2O3) | Surface preparation dependent |
| Copper thickness | 10–130 µm | Plated thickness and pattern evaluated together |
| Line / space | Layout-dependent | Copper thickness, plating distribution and pattern geometry |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au or Ag examples | Finish stack matched to the attachment process |
How to Read the Parameters
- Copper thickness and line/space
Pattern feasibility depends on the finished copper thickness and geometry.
Specify: Thickness distribution, minimum gap, pad shape and registration basis.
- Surface condition
Bare ceramic, plated copper and pad finish are distinct surfaces.
Specify: Functional face, roughness parameter, cleanliness and finish composition/thickness.
- Resistivity and isolation
Volume resistivity uses Ω·cm or Ω·m; finished-circuit insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, time and test geometry.
- RF material and circuit data
Permittivity and loss require frequency and test conditions.
Specify: Operating band, method, conductor stack and circuit-level acceptance.
- Adhesion
Peel in N/mm is not tensile or shear strength in MPa.
Specify: Test mode, geometry, rate, specimen preparation and failure location.
DPC: build and pattern the copper stack
DPC forms patterned copper on ceramic using an adhesion/seed stack, photolithography and electroplating. This substrate-metallization route is separate from any later functional thin-film processing, die attachment or package sealing.
Application Conditions & Design Review
Match pattern detail to the application
Alumina DPC supports a design approach based on patterned copper rather than a generic copper-clad plate. Identify the critical traces, pads and electrical separations in the drawing.
Treat grade and surface as separate choices
Nominal alumina content does not define every surface or electrical property. Select the ceramic grade, surface state and finished metallization around the package and assembly requirements.
Ceramic and copper
Select the ceramic grade and thickness with the plated-copper geometry and heat-source footprint.
Thin-film integration
Identify which resistor, conductor, dielectric or passivation layers will be added after DPC, and review their process compatibility.
Double-sided and via functions
Define each face and any vertical connections explicitly; rear copper does not imply through-hole connectivity.
RF requirements
Specify the operating band and finished-circuit requirements, not merely a low-frequency ceramic dielectric value.
Send With Your Drawing
- Alumina grade, finished thickness, outline and functional surfaces.
- Copper artwork, thickness, line/space requirements and registration datums.
- Finish, attachment method, operating conditions and electrical test requirements.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect critical pattern features, metal thickness and drawing-defined surface geometry.
- Agree continuity/isolation and finish/adhesion criteria for the supplied construction.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 96% or 99.6% alumina selected as distinct ceramic grades.
- Copper thickness, conductor spacing and pad dimensions specified for the same layout.
- Finish stack and any conductive vias identified separately from bare drilled holes.
Engineering Questions
Can the same DPC geometry be used with every copper thickness?
Do not assume so. Pattern dimensions and spacing must be reviewed with the copper build-up and qualified process. State both in the RFQ.
How should the DPC surface finish be selected?
Start with the attachment or downstream film process. Specify finish composition and thickness, pad areas, cleanliness and oxidation protection, then confirm compatibility with the intended soldering, bonding or deposition sequence.
Does a dielectric constant measured at 1 MHz prove microwave performance?
No. Use material data at relevant frequencies and evaluate the actual conductor geometry, finish, interconnections and completed circuit.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 10 pieces or one master-card equivalent |
| Lead-time references | DPC: 5-8 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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