LTCC Glass-Ceramic Multilayer Substrates
Ceramic Substrate
SKU: FWM/CS-ALU-014
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
LTCC Multilayer Substrate
Representative substrate form for drawing review.
Glass-Ceramic Package
Processing route and features are confirmed during RFQ review.
- Material
- LTCC Glass-Ceramic
- Size
- Custom sizes by drawing
- MOQ
- 10 pieces
- Applications
- High-Frequency Packages
Low-temperature co-fired glass-ceramic multilayer substrates for high-frequency and compact electronic packaging; this route is related to, but not classified as, 96% or 99.6% dense alumina.
Clear product and processing details help the team review feasibility, material grade and the appropriate quotation scope.
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Product Description
Review material position, substrate forms and processing scope.
Low-temperature co-fired glass-ceramic multilayer substrates for high-frequency and compact electronic packaging; this route is related to, but not classified as, 96% or 99.6% dense alumina.
Material system, layer stack, conductors, embedded features, cavities and assembly interfaces are confirmed from the customer design.
Processing and inspection are selected for the grade, geometry and assembly process.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- Glass-ceramic material system
- Low-temperature co-fired construction
- High-frequency packaging focus
Typical Applications
- High-Frequency Packages
- Optical Communication
Technical Data
| Selection field | Published position | RFQ confirmation |
|---|---|---|
| Material class | Glass-ceramic | Supplier material system |
| Construction | Low-temperature co-fired multilayer | Layer stack and fired dimensions |
| Conductors | Low-resistance co-fired conductor options | Metal system and layout |
| Primary positioning | High-frequency and compact electronic packaging | Frequency, loss and assembly criteria |
Typical lead times depend on specification, quantity, material availability, drawing and inspection requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
LTCC is related to the electronic-substrate family but is not a 96% or 99.6% dense alumina grade.
- High-Frequency Substrates
- Multilayer Packages
- Cavity Structures
- Custom Integrated Layouts
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | 10 pieces |
| Lead-time references | Bare substrates: 2–4 weeks; Custom processing: 3–5 weeks; Metallized: 4–8 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination