Silicon Nitride AMB Copper-Clad Substrates
Ceramic Substrate
SKU: FWM/CS-AMB-004
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
AMB Copper-Clad Substrate
Representative substrate form for drawing review.
Custom AMB Circuit
Processing route and features are confirmed during RFQ review.
- Material
- Ceramic / Copper AMB System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- Automotive Inverters
Si3N4 AMB copper-clad substrates positioned for high-reliability power modules and repeated thermal cycling.
Metallized substrates require more than an outline drawing.
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Product Description
Review material position, substrate forms and processing scope.
Si3N4 AMB copper-clad substrates positioned for high-reliability power modules and repeated thermal cycling.
Active-metal braze joins thick copper to Si3N4 or selected AlN ceramics.
The quote combines ceramic, copper, layout, finish and assembly requirements.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- AMB — Active Metal Brazed
- Thermal-cycle reliability
- Automotive and SiC modules
Typical Applications
- Automotive Inverters
- High-Reliability Power Modules
Technical Data
| Item | Website reference | Condition |
|---|---|---|
| Ceramic base | Si3N4; selected AlN | Grade and route dependent |
| Si3N4 thickness | 0.25 / 0.32 mm reference | Selected power grades |
| Copper thickness | 0.30 / 0.40 / 0.50 / 0.80 mm | Configuration dependent |
| Pattern | Custom power circuit | Drawing review required |
| Surface finish | Bare Cu and selected plated finishes | Assembly-process dependent |
MOQ and lead time depend on ceramic base, copper layout, finish, panel utilization, quantity and qualification requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
Ceramic base, copper system, circuit layout, finish and qualification requirements are reviewed together.
- Si3N4 AMB Substrates
- Selected AlN AMB Substrates
- Selected Alumina AMB Substrates
- Custom Thick-Copper Power Circuits
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | AMB: 6-10 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination