Silicon Nitride Ceramic Substrate Sheets
Ceramic Substrate
SKU: FWM/CS-SN-001
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
Si3N4 Substrate Sheet
Representative substrate form for drawing review.
Power-Grade Substrate
Processing route and features are confirmed during RFQ review.
- Material
- Silicon Nitride
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces
- Applications
- SiC Power Modules
High-strength Si3N4 substrate sheets for reliability-focused power electronics and severe thermal-cycling applications.
Separate bare-substrate requirements from AMB circuit requirements.
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Product Description
Review material position, substrate forms and processing scope.
High-strength Si3N4 substrate sheets for reliability-focused power electronics and severe thermal-cycling applications.
The selected power-substrate grade and thickness are reviewed against thermal resistance and module reliability.
Bare and AMB requirements are evaluated with the module drawing.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- 650–800+ MPa flexural-strength class
- ≥6 MPa·m½ selected power grades
- 80–90 W/m·K typical power grades
- Bare Si3N4 Substrates
- High strength
- Thermal-shock resistance
Typical Applications
- SiC Power Modules
- Automotive Inverters
Technical Data
| Property | Website reference | Condition |
|---|---|---|
| Density | 3.2–3.3 g/cm³ typical | Grade dependent |
| Flexural strength | 650–800+ MPa | Grade and test-method dependent |
| Fracture toughness | ≥6 MPa·m½ | Selected power-substrate grades |
| Thermal conductivity | 80–90 W/m·K typical | Power-substrate grades |
| CTE | 2.6–3.2 × 10⁻⁶/K typical | Temperature-range dependent |
| Dielectric strength | ≥15 kV/mm reference | Thickness and method dependent |
| Volume resistivity | ≥10¹⁴ Ω·cm typical | At room temperature |
Typical lead times depend on selected grade, layout, copper configuration, quantity and qualification requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
The selected power-substrate grade and thickness are reviewed against thermal resistance and module reliability.
- Bare Si3N4 Substrates
- AMB-Ready Si3N4 Substrates
Packaging & Shipping
Packaging protects ceramic edges and the selected copper finish.
| Item | Details |
|---|---|
| Packaging approach | Packaging protects ceramic edges and the selected copper finish. |
| Protection methods | Individual part or master-card separation; Rigid trays; Surface-protection layers; Corrosion protection for copper where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces |
| Lead-time references | Bare substrates: 4–7 weeks; AMB configurations: 6–10 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination