AMB Ceramic Substrates for Energy Conversion
Ceramic Substrate
SKU: FWM/CS-AMB-003
- Material
- Ceramic / Copper AMB System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- New-Energy Power Systems
AMB copper-clad ceramic substrates for drawing-defined power conversion and new-energy module assemblies.
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Product Description
AMB copper-clad ceramic substrates integrate power-circuit conductors with an insulating ceramic heat path for energy-conversion modules.
Active metal brazing joins copper to the chosen ceramic, supporting layouts for traction inverters, chargers and renewable-energy converters. Ceramic choice and the complete layer stack determine the thermal and mechanical behavior.
For new-energy AMB applications, select the ceramic base, braze system and copper layout together. Material and application qualification are reviewed for the specified design.
Product Advantages
- Brazed copper layers combine power-circuit conductors and attachment areas on ceramic.
- Ceramic selection adapts the insulating heat path to the module design.
- A coordinated copper layout connects device placement, current paths and heat spreading.
Typical Applications
- New-Energy Power Systems: AMB carriers support inverter, charger and DC-DC power circuits.
- Power Conversion: copper-clad ceramic substrates carry power-device assemblies.
Technical Data
Si₃N₄ Substrate (Sinalit) Properties
| Property | Sinalit — bare Si₃N₄ substrate | Conditions / ±10% measurement tolerance (except ref.) |
|---|---|---|
| Density (g/cm³) | ≥3.22 | DIN EN 993-1 |
| Bending strength (MPa) | ≥700 | — |
| Fracture toughness (MPa·m½) | ≥6.5 | Indentation-fracture method |
| Thermal conductivity (W/(m·K)) | 90 | Room temperature; DIN EN 821-2 |
| Coefficient of thermal expansion (10⁻⁶/K) | 3.3 (ref.) | 100–800°C; DIN 51045-1 |
| Dielectric strength (kV/mm) | ≥25 | 20°C; AC / DC; DIN EN 60243-1 |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Young’s modulus (GPa) | ≥280 | ASTM C1259-15 |
| Specific heat capacity (J/(g·K)) | ≥0.68 | 25°C; DIN EN 821-3 Method B |
| Relative permittivity | 7.8 (ref.) | Room temperature; 1 MHz; Ra ≤0.4 µm; ASTM D150 |
| Dielectric loss tangent | ≤0.003 | Room temperature; 1 MHz; Ra ≤0.4 µm; ASTM D150 |
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | Si3N4; selected AlN | Grade and route dependent |
| Si3N4 thickness | 0.25 / 0.32 mm | Si₃N₄ ceramic layer |
| Copper thickness | 0.30 / 0.40 / 0.50 / 0.80 mm | Selected AMB layer combinations |
| Pattern | Custom power circuit | Drawing review required |
| Surface finish | Bare Cu and selected plated finishes | Assembly-process dependent |
How to Read the Parameters
- Bond strength
Peel force per width in N/mm differs from bond stress in MPa.
Specify: Test mode, fixture, specimen, rate and failure location.
- Thermal conductivity
A stated ceramic value is not an effective AMB-stack conductivity.
Specify: Ceramic grade, temperature and method.
- Thermal cycling
A cycle count applies only to its defined construction and profile.
Specify: Endpoints, dwell, ramp/transfer, samples, inspection and failure criteria.
- Layer and panel dimensions
Available combinations cannot be inferred from separate maximum values.
Specify: Complete stack, usable circuit area, outline and finished shape.
AMB: ceramic, braze and copper as one construction
AMB joins copper and ceramic through an active braze system whose reactive elements enable bonding at the ceramic interface. Ceramic grade, braze and copper geometry must be assessed together; generic AMB principles do not establish any one product’s numerical capability.
Application Conditions & Design Review
Translate the energy application into a duty cycle
Traction, charging and stationary conversion can impose different temperature, current and service conditions. Specify the actual converter role rather than using new energy as a single performance class.
Select the ceramic by the limiting requirement
Compare thermal transfer, mechanical robustness, insulation and cost in the proposed module. The ceramic and copper arrangement should be selected together with cooling and assembly.
Ceramic choice
Si3N4, AlN and selected alumina configurations address different thermal and mechanical priorities.
Copper distribution
Layer thickness and copper coverage influence current paths, heat spreading and thermomechanical stress.
Mission profile
Define operating temperatures and loading before choosing substrate and assembly qualification tests.
Send With Your Drawing
- Converter function, heat/current loading and operating environment.
- Candidate ceramic, layer thicknesses, circuit artwork and cooling interface.
- Surface finish, attachment processes and application-specific acceptance plan.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Verify the approved stack, copper geometry and interface inspection requirements.
- Qualify electrical isolation and thermal/mechanical behavior for the intended service profile.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Alumina, AlN or Si3N4 ceramic selection identified with its matching braze construction.
- Ceramic and copper layer thicknesses, pattern coverage and outline defined together.
- Application-specific thermal-cycle and insulation requirements associated with the complete stack.
Engineering Questions
Is one AMB stack suitable for every new-energy application?
No. A charging converter and a traction inverter may have different operating and reliability requirements. Select and qualify the stack for the specific module.
Is the active braze the same as component-attach solder?
No. The active braze is part of the ceramic-to-copper joining system. Die-attach solder or sinter material belongs to a later assembly interface.
Can one AMB product’s cycle result be used for another stack?
Not without evidence. Ceramic grade, braze, copper geometry, layer thicknesses and the test profile must be comparable.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | AMB: 6-10 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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