Laser-Drilled Alumina Ceramic Substrates
Ceramic Substrate
SKU: FWM/CS-ALU-002
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Electronic Packaging
96% alumina substrates with drawing-defined laser holes for electronic circuits, packaging and precision assembly.
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Product Description
Laser-drilled alumina substrates combine an insulating circuit-support plate with holes for locating, mounting or subsequent interconnection processes.
The hole pattern aligns the ceramic with package and assembly features. A drilled opening becomes an electrical via only when a separate conductor or metallization is added.
The holes show through-hole geometry only. Hole diameter, pitch, taper and edge quality must be specified in the drawing.
Product Advantages
- Hole patterns locate the ceramic relative to package features, fasteners or interconnection positions.
- An insulating alumina body supports circuitry around the required openings.
- Drawing-defined holes combine electrical isolation with mechanical access in compact packages.
Typical Applications
- Electronic Packaging: drilled openings align the carrier with package and assembly features.
- Circuit Substrates: holes provide access or locations for a separately specified interconnection process.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Hole diameter
State the required finished size in mm or µm.
Specify: Measurement plane, entrance/exit requirements and tolerance.
- Position
Feature location is defined relative to agreed datums.
Specify: Datum scheme, positional tolerance and inspection method.
- Edge condition
Chips, local damage and transition features need explicit criteria.
Specify: Critical edges, allowable defect definition and inspection area.
- Metallized features
A laser hole alone is not an electrical connection.
Specify: Via construction, metal coverage, continuity and isolation requirements when applicable.
Drilled and machined features: geometry and edge control
Drilled and machined ceramics are defined by their finished features and functional surfaces. Specify the required geometry and acceptance criteria before selecting laser or other machining routes.
01Define each feature
Identify locating holes, mounting holes, slots, cut-outs and later metallization features.
02Review geometry and material
Assess ceramic thickness, feature position, spacing and proximity to critical edges.
03Process and prepare
The selected machining sequence creates the features; any cleaning or further finishing is specified for the material and subsequent process.
04Inspect the result
Measure the finished geometry and assess entrance, exit and edge condition against agreed criteria.
Application Conditions & Design Review
Design each hole for its purpose
Locating holes, mounting holes and future electrical vias need different acceptance criteria. Specify the function before choosing hole size and pitch.
Review both faces
A drilled opening can have different entrance and exit geometry. Evaluate taper and edge condition alongside position accuracy, especially when metallization or a close-fitting component will follow.
Feature function
Mechanical holes and electrically metallized vias have different requirements.
Thickness and geometry
Hole and slot feasibility depends on the ceramic, thickness and local layout.
Assembly datums
Locate features from the surfaces and datums that control the final assembly.
Send With Your Drawing
- Dimensioned CAD with datums, hole pattern, entry/exit requirements and edge distances.
- Alumina grade, plate thickness and surface condition before drilling.
- Hole function, later metallization or attachment, and allowable edge damage.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Measure hole position and both-face geometry against the agreed drawing.
- Inspect sidewalls and edges for unacceptable cracks, chips, recast and debris.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Through-hole patterns with defined diameter, position and datum system.
- Entry and exit geometry, hole taper, edge distance and allowable edge defects treated as separate features.
- Bare drilled plates; conductive hole linings or fillings are separate constructions.
Engineering Questions
Are laser-drilled holes already conductive?
No. A hole in bare alumina remains insulating. A conductive via requires a separately specified metallization or filling system, including continuity and adhesion requirements.
Can the same hole design be used for every ceramic thickness?
Not automatically. Review feature size, shape and edge condition with the selected material and thickness.
If laser drilling is selected, does it include plated-through holes?
No. Drilling defines the opening. Plating or another via conductor is a separate construction that must be specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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