Large-Size Low-Warpage Alumina Ceramic Substrates
Ceramic Substrate
SKU: FWM/CS-ALU-003
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Large Electronic Panels
Large-format 96% alumina substrate configurations reviewed for thickness, flatness, warpage and downstream processing.
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Product Description
Large-format alumina substrates provide a common insulating carrier for multiple circuits or a larger electronic assembly.
Control of overall warpage helps the panel sit consistently on printing, handling and bonding fixtures. Local surface texture and overall flatness remain separate characteristics.
The image represents a substrate form, not a measured size or flatness result. Specify panel dimensions, thickness, warpage and the agreed measurement method.
Product Advantages
- A common panel carries multiple circuit positions through printing and assembly.
- Controlled overall geometry supports consistent seating on processing and handling fixtures.
- Panelized layouts keep related parts together before final separation.
Typical Applications
- Large Electronic Panels: one insulating carrier supports multiple circuit positions.
- Industrial Electronics: larger carriers support extended circuit or assembly footprints.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Control the whole panel
Large panels need a defined reference surface, support condition and measurement span. A low roughness value alone does not describe whether the panel is flat enough for printing or assembly.
Balance format and handling
Panel size and thickness affect support, handling and downstream process setup. Review the usable circuit area, edge margins and eventual singulation rather than selecting the largest format by default.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Panel outline, thickness, usable area, edge margins and final piece layout.
- Flatness or bow definition, datum, measurement span and support condition.
- Printing, metallization or assembly sequence and handling constraints.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect full-panel geometry and thickness variation using the agreed measurement setup.
- Review surface defects and edge integrity in functional and handling areas.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Panel outline, thickness, usable area and edge margins defined together.
- Flatness or bow specified with its datum, support condition and measurement span.
- Local surface finish and thickness variation specified independently from overall warpage.
Engineering Questions
Is surface roughness the same as warpage?
No. Roughness describes local surface texture; warpage describes departure from the intended overall shape. Specify both when the downstream process depends on them.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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