Alumina Ceramic Substrates for Optical Transceivers
Ceramic Substrate
SKU: FWM/CS-ALU-006
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Optical Transceivers
High-purity alumina substrates for optoelectronic transceiver packaging, precision circuits and electrically insulating carriers.
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Product Description
Alumina carriers support optical and electronic components inside transceiver packages, providing electrical isolation and a stable mounting surface.
Their outline and mounting surfaces connect the die locations, optical alignment and package interfaces. Bare carriers, metallized carriers and multilayer packages are distinct constructions.
Representative bare carrier forms are shown. Package outline, alumina purity, metallization and assembly interfaces require separate confirmation.
Product Advantages
- A rigid insulating carrier provides mounting references for optoelectronic components.
- Drawing-defined surfaces connect device placement to the surrounding package geometry.
- The ceramic separates electrical circuits while supporting compact optical and electronic assemblies.
Typical Applications
- Optical Transceivers: the carrier supports optoelectronic devices within the package.
- Optoelectronic Packaging: mounting faces and datums connect component locations to the package outline.
Technical Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Maintain optical reference geometry
A transceiver carrier must support the physical relationship between the laser, detector and optical interfaces. Use explicit mechanical datums rather than assuming the outside edge is the alignment reference.
Review electrical and thermal interfaces together
Driver circuits, optical dies and interconnects can impose different requirements on the same carrier. Define pad finish, ground return and heat removal around the actual package architecture.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Carrier outline, optical/mechanical datums and component placement coordinates.
- Metallization artwork, pad finish and die-attach or wire-bond requirements.
- Heat-source locations, operating conditions and package-level electrical test targets.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Check datum relationships, surface geometry and metallization registration.
- Validate optical alignment, electrical function and thermal behavior on the assembled module.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 99.6% alumina carriers with device locations, outlines and reference datums.
- Mounting-face flatness, thickness and surface finish defined for attachment.
- Bare, metallized and multilayer configurations identified as distinct constructions.
Engineering Questions
Does alumina alone establish the transceiver data rate?
No. Data rate depends on the devices, interconnect geometry, dielectric behavior and complete package design. The substrate is one element of that system.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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