AlN DBC Substrates for Thermoelectric Modules
Ceramic Substrate
SKU: FWM/CS-DBC-001
- Material
- Ceramic / Direct-Bonded Copper System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- Thermoelectric Modules
AlN DBC substrates for thermoelectric modules requiring thick copper, electrical insulation and efficient heat transfer.
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Product Description
AlN DBC substrates combine bonded copper electrodes with an aluminum nitride insulating layer for thermoelectric module assemblies.
The copper connects the thermoelectric elements, while AlN provides a heat-transfer path between the assembly and its external contact surfaces. The substrate is the copper/ceramic carrier, not the completed thermoelectric module.
A DBC electrode layout on AlN is illustrated, without thermoelectric pellets or a completed module. Confirm both-face patterns and the assembly design.
Product Advantages
- Bonded copper electrodes connect the thermoelectric elements on an insulating carrier.
- The AlN layer carries heat between the module assembly and its external contact surfaces.
- A joined copper/ceramic construction supports the electrode pattern through assembly.
Typical Applications
- Thermoelectric Modules: copper electrodes provide element connections over an AlN insulating layer.
- Power Electronics: AlN/copper carriers support thermoelectric assemblies used in electronic temperature-control systems.
Technical Data
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | Aluminum nitride (AlN) | Route dependent |
| Ceramic thickness | AlN: 0.25–1.50 mm | Matched ceramic / copper stack |
| Copper thickness | 0.10–0.30 mm | Copper thickness and ceramic stack selected together |
| Line / space | Etched-pattern dependent | Copper thickness, etch profile and insulation clearance |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Construction-specific test | Peel method, coupon geometry and acceptance criterion |
How to Read the Parameters
- Copper thickness
Foil thickness influences conductor cross-section and etched geometry.
Specify: Finished thickness, sidewall/gap requirements and patterning rules.
- Ceramic conductivity
W/(m·K) describes the ceramic at stated conditions.
Specify: Grade and temperature; keep separate from finished thermal resistance.
- Flatness and copper balance
Incoming ceramic shape does not establish the finished bonded shape.
Specify: Top/bottom pattern, copper-free perimeter and inspection condition.
- Dielectric performance
Material breakdown strength in kV/mm is not an assembly working-voltage rating.
Specify: Stack, gaps, edge clearances, waveform and test conditions.
DBC: bonded copper foil for power circuits
DBC uses a copper–oxygen eutectic interfacial reaction at elevated temperature to join copper foil to a ceramic surface. Conventional AlN DBC includes controlled oxide-surface preparation because AlN is a non-oxide ceramic. The bonded foil is then patterned; it is distinct from printed and fired thick-film conductors or resistors.
How the substrate fits into a thermoelectric module
Application Conditions & Design Review
Coordinate copper electrodes with the thermoelectric array
An AlN DBC substrate can form a copper-patterned insulating plate within a thermoelectric assembly. Define the pellet layout and electrical connections rather than specifying only a copper-clad blank.
Review plate-to-system contact
The thermal path includes the ceramic, copper, attachment layers and external interfaces. Plan flatness, mounting support and hot-side heat rejection around the finished module.
Current and geometry
Choose copper thickness with conductor width, spacing and patterning feasibility.
Thermal and mechanical balance
Review ceramic thickness, copper distribution and the completed heat path together.
Hybrid integration
If printed films are needed, define their function and compatibility separately from the bonded copper.
Send With Your Drawing
- AlN/copper thicknesses and electrode artwork for the thermoelectric array.
- Pad finish, pellet attachment and module assembly conditions.
- Plate geometry, mounting interfaces and module-level test requirements.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect copper pattern, substrate geometry and specified bond/interface criteria.
- Verify net connectivity and isolation; evaluate cooling and cycling on the assembled module.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- AlN ceramic thickness and bonded copper thickness selected for the electrode construction.
- Electrode layout, attachment finish and copper balance coordinated with the element positions.
- Contact-face flatness and parallelism defined separately from ceramic conductivity.
Engineering Questions
Is AlN DBC supplied as a complete thermoelectric module?
Not unless the scope explicitly includes module assembly. The substrate is the copper/ceramic carrier; thermoelectric elements, connections and system cooling are separate parts.
Is DBC just copper mechanically attached to ceramic?
No. DBC is a controlled high-temperature bonding technology, not merely mechanical attachment.
Why must copper thickness and circuit spacing be reviewed together?
Thicker copper changes the conductor cross-section and etched sidewall geometry. Confirm finished track width, isolation gap and edge clearances for the selected thickness rather than applying one spacing rule to every stack.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | DBC: 5-9 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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