Double-Sided Copper-Clad DBC Substrates
Ceramic Substrate
SKU: FWM/CS-DBC-002
- Material
- Ceramic / Direct-Bonded Copper System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- Power Modules
Double-sided DBC ceramic substrates for established high-current power layouts and thermal-management assemblies.
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Product Description
Double-sided DBC substrates bond copper foil to both faces of a ceramic insulating layer for power-electronic circuits.
The component-side copper forms current paths and attachment pads; the rear side can spread heat or provide a cooling interface. The two faces may have different patterns and finishes within one joined construction.
For double-sided DBC, specify the ceramic material and the copper thickness and pattern on each face.
Product Advantages
- Bonded copper on both faces supports device-side circuits and rear heat-spreading areas.
- The ceramic layer electrically separates the two copper patterns.
- Independent face layouts adapt conductor coverage to the module construction.
Typical Applications
- Power Modules: front copper carries devices and interconnections while rear copper interfaces with cooling.
- Industrial Drives: double-sided constructions combine conductors, insulation and mechanical support.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% Al2O3 or AlN | Route dependent |
| Ceramic thickness | Alumina: 0.25–1.00 mm; AlN: 0.25–1.50 mm | Matched ceramic / copper stack |
| Copper thickness | 0.10–0.30 mm | Copper thickness and ceramic stack selected together |
| Line / space | Etched-pattern dependent | Copper thickness, etch profile and insulation clearance |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Construction-specific test | Peel method, coupon geometry and acceptance criterion |
How to Read the Parameters
- Copper thickness
Foil thickness influences conductor cross-section and etched geometry.
Specify: Finished thickness, sidewall/gap requirements and patterning rules.
- Ceramic conductivity
W/(m·K) describes the ceramic at stated conditions.
Specify: Grade and temperature; keep separate from finished thermal resistance.
- Flatness and copper balance
Incoming ceramic shape does not establish the finished bonded shape.
Specify: Top/bottom pattern, copper-free perimeter and inspection condition.
- Dielectric performance
Material breakdown strength in kV/mm is not an assembly working-voltage rating.
Specify: Stack, gaps, edge clearances, waveform and test conditions.
DBC: bonded copper foil for power circuits
DBC uses a copper–oxygen eutectic interfacial reaction at elevated temperature to join copper foil to a ceramic surface. Conventional AlN DBC includes controlled oxide-surface preparation because AlN is a non-oxide ceramic. The bonded foil is then patterned; it is distinct from printed and fired thick-film conductors or resistors.
Application Conditions & Design Review
Describe both copper surfaces
A double-sided DBC design may use a patterned component side and a broader rear heat-spreading area. State the function of each surface and its attachment requirements.
Review layout symmetry and mounting
Copper thickness and coverage should be considered with substrate shape and assembly support. The drawing should identify functional flatness areas rather than rely on a general two-sided label.
Current and geometry
Choose copper thickness with conductor width, spacing and patterning feasibility.
Thermal and mechanical balance
Review ceramic thickness, copper distribution and the completed heat path together.
Hybrid integration
If printed films are needed, define their function and compatibility separately from the bonded copper.
Send With Your Drawing
- Top/bottom copper thicknesses, artwork and electrical/thermal functions.
- Ceramic type, thickness, outline and shape/flatness requirements.
- Surface finish, component attachment and cooling/mounting construction.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect copper geometry, registration and drawing-defined substrate shape.
- Define copper/ceramic bond and electrical tests for the supplied configuration.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Top and bottom copper thicknesses, etched patterns and finishes specified independently.
- Copper balance, edge clearance and ceramic outline defined as one bonded stack.
- Different face patterns permitted in the design; conductive vias are a separate construction.
Engineering Questions
Must both sides carry identical circuits?
No. Their functions may differ. Specify each pattern and surface independently, then review the combined thermal and mechanical construction.
Is DBC just copper mechanically attached to ceramic?
No. DBC is a controlled high-temperature bonding technology, not merely mechanical attachment.
Why must copper thickness and circuit spacing be reviewed together?
Thicker copper changes the conductor cross-section and etched sidewall geometry. Confirm finished track width, isolation gap and edge clearances for the selected thickness rather than applying one spacing rule to every stack.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | DBC: 5-9 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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