Alumina Direct-Bonded Copper DBC Substrates
Ceramic Substrate
SKU: FWM/CS-DBC-005
- Material
- Ceramic / Direct-Bonded Copper System
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces or one master-card equivalent
- Applications
- Industrial Power Modules
Alumina DBC substrates for mature thick-copper power circuits and cost-balanced electronic assemblies.
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Product Description
Alumina DBC substrates are bonded copper/ceramic carriers for industrial power modules, motor drives and other power circuits.
Copper foil provides current paths and heat spreading, while the alumina layer electrically separates the circuit from the mounting structure. This established construction combines conductor, insulator and mechanical support in one substrate.
Copper bonded to alumina is shown as a reference form. Confirm ceramic purity, copper thickness, circuit pattern and required surface finish.
Product Advantages
- Bonded copper foil carries current and spreads heat across the substrate.
- The alumina layer electrically separates the circuit from its mounting structure.
- A rigid copper/ceramic carrier combines device attachment with mechanical support.
Typical Applications
- Industrial Power Modules: copper circuits support device attachment over alumina insulation.
- Motor Drives: bonded ceramic carriers provide current paths and a thermal interface.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% alumina (Al2O3) | Route dependent |
| Ceramic thickness | Alumina: 0.25–1.00 mm | Matched ceramic / copper stack |
| Copper thickness | 0.10–0.30 mm | Copper thickness and ceramic stack selected together |
| Line / space | Etched-pattern dependent | Copper thickness, etch profile and insulation clearance |
| Surface finish | Bare/protected Cu; selected Ni, Ni/Au or Ag | Assembly-process dependent |
| Bond / peel testing | Construction-specific test | Peel method, coupon geometry and acceptance criterion |
How to Read the Parameters
- Copper thickness
Foil thickness influences conductor cross-section and etched geometry.
Specify: Finished thickness, sidewall/gap requirements and patterning rules.
- Ceramic conductivity
W/(m·K) describes the ceramic at stated conditions.
Specify: Grade and temperature; keep separate from finished thermal resistance.
- Flatness and copper balance
Incoming ceramic shape does not establish the finished bonded shape.
Specify: Top/bottom pattern, copper-free perimeter and inspection condition.
- Dielectric performance
Material breakdown strength in kV/mm is not an assembly working-voltage rating.
Specify: Stack, gaps, edge clearances, waveform and test conditions.
DBC: bonded copper foil for power circuits
DBC uses a copper–oxygen eutectic interfacial reaction at elevated temperature to join copper foil to a ceramic surface. Conventional AlN DBC includes controlled oxide-surface preparation because AlN is a non-oxide ceramic. The bonded foil is then patterned; it is distinct from printed and fired thick-film conductors or resistors.
Application Conditions & Design Review
Choose a balanced power-substrate construction
Alumina DBC is an established copper/ceramic route for power circuits. Select the ceramic thickness and copper arrangement around insulation, heat spreading and current-path requirements.
Define what the copper surface must support
Component attachment, wire bonding and the rear thermal interface place different demands on the metal surface. Specify finishes and functional areas separately where necessary.
Current and geometry
Choose copper thickness with conductor width, spacing and patterning feasibility.
Thermal and mechanical balance
Review ceramic thickness, copper distribution and the completed heat path together.
Hybrid integration
If printed films are needed, define their function and compatibility separately from the bonded copper.
Send With Your Drawing
- Alumina grade, ceramic/copper thicknesses and circuit artwork.
- Clearance/creepage design inputs, isolation test conditions and edge geometry.
- Finish by surface and the intended die-attach, interconnect and cooling methods.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect copper geometry, ceramic edges and specified bond/interface quality.
- Verify the agreed electrical tests and qualify thermal/mechanical behavior in the module.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 96% alumina ceramic thickness and copper foil thickness selected as one stack.
- Etched conductor pattern, copper balance and ceramic edge clearance defined together.
- Attachment finish and backside contact geometry specified for the module assembly.
Engineering Questions
Can a catalog dielectric-strength value define the module working voltage?
No. Working isolation also depends on conductor spacing, surface paths, edges and the complete insulation system. Define the applicable assembly test and acceptance conditions.
Is DBC just copper mechanically attached to ceramic?
No. DBC is a controlled high-temperature bonding technology, not merely mechanical attachment.
Why must copper thickness and circuit spacing be reviewed together?
Thicker copper changes the conductor cross-section and etched sidewall geometry. Confirm finished track width, isolation gap and edge clearances for the selected thickness rather than applying one spacing rule to every stack.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces or one master-card equivalent |
| Lead-time references | DBC: 5-9 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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