Double-Sided DPC Metallized Ceramic Substrates
Ceramic Substrate
SKU: FWM/CS-DPC-001
- Material
- Ceramic / Plated Copper System
- Size
- Custom sizes by drawing
- MOQ
- 10 pieces or one master-card equivalent
- Applications
- Power and RF Packages
Double-sided DPC substrates for compact circuit layouts and controlled plated-copper integration.
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Product Description
Double-sided DPC substrates carry plated copper features on both faces of an insulating ceramic carrier.
Each face can provide circuit pads, heat-spreading areas or attachment surfaces for compact electronic packages. An electrical connection between the faces requires a defined via structure; two-sided copper alone does not provide it.
For double-sided DPC, specify the ceramic material, conductor pattern on each face and any plated vias. Each side is reviewed against the drawing.
Product Advantages
- Copper patterns on both faces provide separate circuit or attachment functions.
- Photolithographic patterning organizes pads and traces within the ceramic footprint.
- The ceramic electrically separates the two faces while supporting the plated conductors.
Typical Applications
- Power and RF Packages: two-sided copper provides device-side and rear-side connection areas.
- Microelectronics: independently patterned faces support dense packaging layouts.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% / 99.6% Al2O3 or AlN | Surface preparation dependent |
| Copper thickness | 10–130 µm | Plated thickness and pattern evaluated together |
| Line / space | Layout-dependent | Copper thickness, plating distribution and pattern geometry |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au or Ag examples | Finish stack matched to the attachment process |
How to Read the Parameters
- Copper thickness and line/space
Pattern feasibility depends on the finished copper thickness and geometry.
Specify: Thickness distribution, minimum gap, pad shape and registration basis.
- Surface condition
Bare ceramic, plated copper and pad finish are distinct surfaces.
Specify: Functional face, roughness parameter, cleanliness and finish composition/thickness.
- Resistivity and isolation
Volume resistivity uses Ω·cm or Ω·m; finished-circuit insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, time and test geometry.
- RF material and circuit data
Permittivity and loss require frequency and test conditions.
Specify: Operating band, method, conductor stack and circuit-level acceptance.
- Adhesion
Peel in N/mm is not tensile or shear strength in MPa.
Specify: Test mode, geometry, rate, specimen preparation and failure location.
DPC: build and pattern the copper stack
DPC forms patterned copper on ceramic using an adhesion/seed stack, photolithography and electroplating. This substrate-metallization route is separate from any later functional thin-film processing, die attachment or package sealing.
Application Conditions & Design Review
Give each copper face a defined function
The rear face may carry a circuit, act as a heat-spreading area or serve a mounting interface. Specify its role independently from the component side.
Review registration and connectivity
Two-sided patterns need a common datum system. Electrical connection through the ceramic is a separate feature and must not be inferred simply because both surfaces have copper.
Ceramic and copper
Select the ceramic grade and thickness with the plated-copper geometry and heat-source footprint.
Thin-film integration
Identify which resistor, conductor, dielectric or passivation layers will be added after DPC, and review their process compatibility.
Double-sided and via functions
Define each face and any vertical connections explicitly; rear copper does not imply through-hole connectivity.
RF requirements
Specify the operating band and finished-circuit requirements, not merely a low-frequency ceramic dielectric value.
Send With Your Drawing
- Top/bottom artwork, common datums and each face's electrical or thermal function.
- Ceramic and copper thicknesses, finish per face and flatness requirements.
- Any via structure, connection map and assembly/cooling interfaces.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect face-to-face registration, copper thickness and specified surface geometry.
- Test the defined net connections and isolation, including vias only where specified.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Top and bottom copper thicknesses, patterns and finishes specified separately.
- Front-to-back pattern registration defined relative to the ceramic outline.
- Conductive vias included only when their lining or filling construction is specified.
Engineering Questions
Does double-sided DPC automatically provide through-hole connections?
No. Specify via locations, structure and connectivity separately. Without those features, the ceramic separates the two copper faces electrically.
How should the DPC surface finish be selected?
Start with the attachment or downstream film process. Specify finish composition and thickness, pad areas, cleanliness and oxidation protection, then confirm compatibility with the intended soldering, bonding or deposition sequence.
Does a dielectric constant measured at 1 MHz prove microwave performance?
No. Use material data at relevant frequencies and evaluate the actual conductor geometry, finish, interconnections and completed circuit.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 10 pieces or one master-card equivalent |
| Lead-time references | DPC: 5-8 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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