DPC Metallized Substrates for Thin-Film Assemblies
Ceramic Substrate
SKU: FWM/CS-DPC-002
- Material
- Ceramic / Plated Copper System
- Size
- Custom sizes by drawing
- MOQ
- 10 pieces or one master-card equivalent
- Applications
- Thin-Film Circuits
Fine-pattern DPC substrates for precision electronic packages, with conductor-stack review to distinguish plated copper from other thin-film systems.
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Product Description
DPC substrates provide patterned copper conductors and connection pads on ceramic for precision electronic packages.
Seed-layer deposition, photolithography and copper plating form the conductor pattern. DPC is a plated-copper process, distinct from the resistive, dielectric or other functional films that a thin-film circuit may also require.
DPC is a plated-copper route, not a synonym for every thin-film metal system. Confirm the required conductor stack and circuit design before route selection.
Product Advantages
- Plated copper forms the conductor pattern and attachment pads on ceramic.
- Photolithographic definition connects fine circuit layouts to package interfaces.
- The insulating carrier supports further compatible functional-film processing.
Typical Applications
- Thin-Film Circuits: DPC supplies copper conductors and connection pads.
- Precision Electronics: patterned ceramic carriers support component attachment and interconnection.
Technical Data
96% Alumina Substrate (708 S) Properties
| Property | 96% Al₂O₃ — 708 S | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.75 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥500 | — |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | 24 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.75 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | ~9.8 | Room temperature, 1 MHz; Ra ≤0.4 µm |
| Dielectric loss factor | ≤0.005 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
Typical Construction Parameters
| Construction item | Typical configuration | Applicable condition |
|---|---|---|
| Ceramic base | 96% / 99.6% Al2O3 or AlN | Surface preparation dependent |
| Copper thickness | 10–130 µm | Plated thickness and pattern evaluated together |
| Line / space | Layout-dependent | Copper thickness, plating distribution and pattern geometry |
| Holes / vias | Laser holes and selected plated features | Aspect ratio and registration dependent |
| Surface finish | Ni/Au, Ni/Pd/Au or Ag examples | Finish stack matched to the attachment process |
How to Read the Parameters
- Copper thickness and line/space
Pattern feasibility depends on the finished copper thickness and geometry.
Specify: Thickness distribution, minimum gap, pad shape and registration basis.
- Surface condition
Bare ceramic, plated copper and pad finish are distinct surfaces.
Specify: Functional face, roughness parameter, cleanliness and finish composition/thickness.
- Resistivity and isolation
Volume resistivity uses Ω·cm or Ω·m; finished-circuit insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, time and test geometry.
- RF material and circuit data
Permittivity and loss require frequency and test conditions.
Specify: Operating band, method, conductor stack and circuit-level acceptance.
- Adhesion
Peel in N/mm is not tensile or shear strength in MPa.
Specify: Test mode, geometry, rate, specimen preparation and failure location.
DPC: build and pattern the copper stack
DPC forms patterned copper on ceramic using an adhesion/seed stack, photolithography and electroplating. This substrate-metallization route is separate from any later functional thin-film processing, die attachment or package sealing.
Application Conditions & Design Review
Match the conductor stack to the circuit
DPC is useful when a ceramic carrier needs patterned copper interconnects alongside small mounting pads. For a thin-film assembly, identify which layers belong to the supplied copper circuit and which resistive, dielectric or functional films will be added later. A plated copper surface is not automatically a finished thin-film circuit.
Select around heat flow and assembly
Choose the ceramic, copper geometry and surface finish together. AlN is a candidate when heat transfer is a leading constraint; alumina may suit a more cost-sensitive carrier. RF behavior and bonding compatibility still depend on the complete layout, film stack and package, not the ceramic name alone.
Ceramic and copper
Select the ceramic grade and thickness with the plated-copper geometry and heat-source footprint.
Thin-film integration
Identify which resistor, conductor, dielectric or passivation layers will be added after DPC, and review their process compatibility.
Double-sided and via functions
Define each face and any vertical connections explicitly; rear copper does not imply through-hole connectivity.
RF requirements
Specify the operating band and finished-circuit requirements, not merely a low-frequency ceramic dielectric value.
Send With Your Drawing
- Ceramic material, finished thickness, outline and any flatness or thickness-variation requirement.
- Top and bottom circuit files, copper thickness, minimum line/space and the location and function of any vias.
- Downstream film stack, pad finish, die-attach or wire-bond process, operating frequency and isolation requirement.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Review conductor width/spacing, registration, copper thickness and continuity/isolation against the approved drawing and test conditions.
- Define surface-defect, finish and adhesion requirements for the intended deposition or assembly process; qualify representative samples before release.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Copper layout, plating thickness and pad finishes defined as a DPC construction.
- Functional resistor or dielectric films specified separately from the plated copper.
- Ceramic grade and surface state matched to the combined circuit-processing sequence.
Engineering Questions
Does DPC replace all thin-film processing?
No. DPC supplies a patterned copper metallization system. A design may still require separate resistive, dielectric or other functional films. Confirm the layer order, compatible surface finish and which processing steps are included in the supplied part.
How should the DPC surface finish be selected?
Start with the attachment or downstream film process. Specify finish composition and thickness, pad areas, cleanliness and oxidation protection, then confirm compatibility with the intended soldering, bonding or deposition sequence.
Does a dielectric constant measured at 1 MHz prove microwave performance?
No. Use material data at relevant frequencies and evaluate the actual conductor geometry, finish, interconnections and completed circuit.
Packaging & Shipping
Packaging is selected for master cards, individual units and copper surface condition.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for master cards, individual units and copper surface condition. |
| Protection methods | Individual separation; Anti-scratch surface protection; Rigid trays or master-card frames; Copper corrosion protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 10 pieces or one master-card equivalent |
| Lead-time references | DPC: 5-8 weeks |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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