Aluminum Nitride Ceramic Substrates for Thick-Film Circuits
Ceramic Substrate
SKU: FWM/CS-ALN-002
Product Configuration
Conceptual substrate forms only; final geometry, processing and surface condition follow the approved drawing.
AlN Substrate
Representative substrate form for drawing review.
Processed AlN Substrate
Processing route and features are confirmed during RFQ review.
- Material
- Aluminum Nitride
- Size
- Custom sizes by drawing
- MOQ
- 5 pieces
- Applications
- Thick-Film Circuits
AlN substrates prepared for thick-film circuit processing where thermal management and electrical insulation are required.
Thermal-conductivity class and surface condition are essential to a useful AlN quotation.
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Product Description
Review material position, substrate forms and processing scope.
AlN substrates prepared for thick-film circuit processing where thermal management and electrical insulation are required.
Thermal conductivity varies with grade and formulation. Higher-conductivity options are selected when thermal modeling justifies them.
Custom outlines and surfaces are reviewed with the grade and assembly process.
Published numerical values are typical references. Final specifications remain subject to material grade, geometry, supplier capability and agreed test method.
Product Features
- 170 W/m·K typical standard grade
- Higher-conductivity grades available
- Laser processing and metallization
- Standard AlN Grade
- Balanced performance
- Broad power and optoelectronic use
Typical Applications
- Thick-Film Circuits
- Hybrid Microelectronics
Technical Data
| Property | Website reference | Condition |
|---|---|---|
| Density | 3.26–3.33 g/cm³ typical | Grade dependent |
| Flexural strength | 330–450 MPa typical | Method and grade dependent |
| Thermal conductivity | 170 W/m·K typical standard grade | Higher-conductivity 200–230 W/m·K class options |
| CTE | 4.5–4.7 × 10⁻⁶/K typical | Temperature range dependent |
| Dielectric constant | About 8.5–9.0 at 1 MHz | Grade and method dependent |
| Volume resistivity | ≥10¹³ Ω·cm typical | At room temperature |
| Dielectric strength | >15 kV/mm typical | Depends on thickness and test method |
Typical lead times depend on grade availability, drawing, quantity, processing and inspection requirements. Values shown are typical engineering references, not guaranteed order specifications. Final values require grade, drawing, supplier route and test-basis confirmation.
Available Forms
Product forms are quoted to drawing without implying a separate SKU page.
- Standard AlN Substrates
- Higher-Conductivity AlN Substrates
- Laser-Processed AlN Substrates
- Polished AlN Substrates
- Metallization-Ready AlN Substrates
Packaging & Shipping
AlN substrates receive individual separation and surface protection appropriate to the finish.
| Item | Details |
|---|---|
| Packaging approach | AlN substrates receive individual separation and surface protection appropriate to the finish. |
| Protection methods | Individual separation; Anti-scratch interlayers; Rigid trays or foam protection; Moisture protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | 5 pieces |
| Lead-time references | Bare substrates: 3–5 weeks; Precision processing: 4–6 weeks; Metallized: 5–9 weeks |
About FreeWill Material
FreeWill Material supplies technical ceramic components for demanding industrial applications. Our product range includes silicon carbide, silicon nitride, alumina, zirconia and other engineered ceramic materials.
We work with qualified manufacturing resources in China to support material selection, drawing-based customization, production coordination, inspection documentation and export delivery. Component feasibility, tolerances and material grades are reviewed according to the customer's drawings and operating conditions.
Our focus is to provide international buyers with clear technical communication, practical sourcing support and responsive quotation service for custom ceramic components.
- Drawing-Based Customization
- Material Selection Support
- Inspection Documentation
- Export Coordination