Aluminum Nitride Substrates for Thick-Film Circuits
Ceramic Substrate
SKU: FWM/CS-ALN-002
- Material
- Aluminum Nitride
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Thick-Film Circuits
AlN substrates prepared for thick-film circuit processing where thermal management and electrical insulation are required.
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Product Description
Aluminum nitride substrates support printed and fired circuit layers in hybrid electronic assemblies that need an electrically insulating heat path.
The ceramic carries heat from the circuit toward the cooling surface. Conductive, resistive and dielectric pastes must be compatible with AlN and the chosen firing process; an alumina process is not automatically transferable.
Bare AlN is shown; an application name does not imply an included circuit or copper cladding. Confirm the downstream circuit and assembly process.
Product Advantages
- An insulating AlN carrier supports printed and fired circuit layers.
- Heat conduction through the ceramic supports the thermal path from active circuit areas.
- Surface preparation provides the interface for the selected paste and firing system.
Typical Applications
- Thick-Film Circuits: AlN supports printed conductor, resistor and dielectric layers.
- Hybrid Microelectronics: the ceramic combines component support with an insulating heat path.
Technical Data
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
How to Read the Parameters
- Thermal conductivity
A ceramic property in W/(m·K), not a complete-stack rating.
Specify: Grade, temperature, direction where relevant and method.
- Thermal resistance
A defined heat-path result in K/W.
Specify: Heat-source area, layer dimensions, interfaces and cooling boundary.
- Thermal expansion
CTE is expressed in ppm/K or ×10⁻⁶/K over an interval.
Specify: Temperature interval and whether the value describes ceramic or the effective stack.
- Surface and geometry
A high-conductivity grade does not determine roughness or flatness.
Specify: Functional faces, thickness variation and dimensional acceptance separately.
AlN: an insulating thermal path
Aluminum nitride is considered when ceramic heat transfer is a major constraint. Its bulk conductivity must be distinguished from the thermal resistance of the finished substrate and module.
01Define the thermal requirement
Identify the heat-source footprint, temperature target, cooling interface and intended conductor system.
02Select the AlN grade
Review ceramic conductivity and other material properties at the relevant conditions.
03Prepare the specified form
Choose the delivered bare, machined or surface-finished condition for subsequent processing.
04Validate the interfaces
Evaluate film or metallization compatibility, attachment and cooling interfaces as part of the full construction.
Application Conditions & Design Review
Qualify a compatible paste system
Do not assume a printing and firing recipe developed for alumina transfers unchanged to AlN. Select conductor, resistor and dielectric materials specifically for the intended substrate and process.
Review the full thermal sequence
Printing is only one step. Drying, firing, repeated passes and later attachment all contribute to the final film and interface condition, so define the complete sequence before qualification.
Heat path
Include ceramic thickness, copper, attachment layers and contact area in the thermal assessment.
Downstream process
Identify deposited films or printed pastes, firing atmosphere and chemical exposures before selecting the surface.
Finished delivery state
Distinguish an as-fired blank from a polished plate or an already metallized substrate.
Send With Your Drawing
- AlN grade, panel geometry and printing-face specification.
- Paste identities, layer order and drying/firing atmosphere and profiles.
- Circuit layout, registration features and later attachment conditions.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect substrate surface condition and geometry before printing.
- Test film adhesion and electrical behavior after the defined firing and assembly sequence.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- AlN outline, thickness and surface state matched to the printing layout.
- Paste chemistry, firing atmosphere and firing sequence associated with the selected circuit process.
- Bare-carrier geometry specified separately from the printed functional layers.
Engineering Questions
Can a standard alumina thick-film paste be used without testing on AlN?
Compatibility should not be assumed. Confirm the paste supplier's guidance and qualify the chosen materials and firing conditions on AlN.
Does high AlN conductivity guarantee a cooler module?
No. The benefit depends on ceramic thickness, heat-source area, attachment layers and heat rejection. Evaluate the complete heat path.
Can an alumina film process be transferred directly to AlN?
Not without review. Confirm that the paste or deposited stack, atmosphere, thermal cycle and cleaning chemistry are compatible with the selected AlN system.
Packaging & Shipping
AlN substrates receive individual separation and surface protection appropriate to the finish.
| Item | Details |
|---|---|
| Packaging approach | AlN substrates receive individual separation and surface protection appropriate to the finish. |
| Protection methods | Individual separation; Anti-scratch interlayers; Rigid trays or foam protection; Moisture protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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