FreeWill Material Technical Ceramics

Laser Precision-Machined Aluminum Nitride Substrates

Ceramic Substrate

SKU: FWM/CS-ALN-006

Machined AlN ceramic substrates with holes, slots and cut-outs
Material
Aluminum Nitride
Size
Custom sizes by drawing
MOQ
By quotation
Applications
Precision Electronic Packaging

AlN substrates with drawing-defined laser outlines, holes and precision features for electronic assembly.

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Product Description

FreeWill Material ceramic substrates and power module thermal-management assembly

Laser-machined AlN substrates combine a heat-conducting insulating ceramic body with custom outlines, openings and assembly features.

These features position the substrate within electronic packages and provide clearance or mounting interfaces. Full cuts, shallow scribes and through-holes perform different functions in the finished part.

Holes and outline features illustrate drawing-based processing. Final geometry, feature sizes, tolerances and edge acceptance follow the approved drawing.

Product Advantages

  • Machined outlines and openings integrate the carrier with electronic-package features.
  • AlN retains its heat-conducting, electrically insulating role around the machined geometry.
  • Common reference datums connect cut-outs, holes and mounting locations.

Typical Applications

  • Precision Electronic Packaging: shaped AlN carriers fit package outlines and mounting interfaces.
  • Custom Circuits: openings and locating features align the ceramic with the assembly.

Technical Data

95% AlN Substrate Properties

Property95% AlN typical valueCondition / method
AlN content (%)95—
Density (g/cm³)≥3.3—
Flexural strength (MPa)≥400—
Thermal conductivity (W/(m·K))≥170Room temperature
Relative permittivity8–101 MHz; room temperature
Dielectric loss tangent≤0.00031 MHz; room temperature
Dielectric strength (kV/mm)17—
Volume resistivity (Ω·cm)≥10¹⁴—

How to Read the Parameters

Hole diameter

State the required finished size in mm or µm.

Specify: Measurement plane, entrance/exit requirements and tolerance.

Position

Feature location is defined relative to agreed datums.

Specify: Datum scheme, positional tolerance and inspection method.

Edge condition

Chips, local damage and transition features need explicit criteria.

Specify: Critical edges, allowable defect definition and inspection area.

Metallized features

A laser hole alone is not an electrical connection.

Specify: Via construction, metal coverage, continuity and isolation requirements when applicable.

Drilled and machined features: geometry and edge control

Drilled and machined ceramics are defined by their finished features and functional surfaces. Specify the required geometry and acceptance criteria before selecting laser or other machining routes.

  1. 01Define each feature

    Identify locating holes, mounting holes, slots, cut-outs and later metallization features.

  2. 02Review geometry and material

    Assess ceramic thickness, feature position, spacing and proximity to critical edges.

  3. 03Process and prepare

    The selected machining sequence creates the features; any cleaning or further finishing is specified for the material and subsequent process.

  4. 04Inspect the result

    Measure the finished geometry and assess entrance, exit and edge condition against agreed criteria.

Application Conditions & Design Review

Distinguish the feature types

An outline cut, shallow scribe, through-hole and slot are not the same machining requirement. Give each feature a function and datum so the process review can focus on the relevant geometry.

Inspect the processed surface

Non-contact processing does not remove the need to evaluate ceramic damage. Agree how edge chips, cracks, taper, debris and any heat-affected surface will be assessed.

Feature function

Mechanical holes and electrically metallized vias have different requirements.

Thickness and geometry

Hole and slot feasibility depends on the ceramic, thickness and local layout.

Assembly datums

Locate features from the surfaces and datums that control the final assembly.

Send With Your Drawing

  • AlN thickness and CAD identifying cuts, scribes, holes and slots.
  • Datums, critical dimensions, edge distances and downstream fit requirements.
  • Functional-surface protection, later metallization and allowable process damage.

Include the drawing revision, sample and production quantities, and required inspection documents.

Define Acceptance Before Production

  • Measure the agreed feature geometry and its location from the specified datums.
  • Inspect processed edges and surfaces for unacceptable damage or residue.

Agree the test methods, sampling plan, acceptance limits and required reports before production.

Available Forms & Processing

Product-specific geometry and processing features.

  • Full-depth outlines, through-holes and slots identified separately from shallow scribes.
  • Feature positions, edge distances and entry/exit geometry defined relative to common datums.
  • Edge quality, functional-area defects and thickness considered with the selected laser features.

Engineering Questions

Does laser machining mean the ceramic is automatically free of stress or damage?

No. The process must be matched to the material and geometry, and the finished features inspected against agreed damage criteria.

Can the same hole design be used for every ceramic thickness?

Not automatically. Review feature size, shape and edge condition with the selected material and thickness.

If laser drilling is selected, does it include plated-through holes?

No. Drilling defines the opening. Plating or another via conductor is a separate construction that must be specified and qualified.

Packaging & Shipping

AlN substrates receive individual separation and surface protection appropriate to the finish.

ItemDetails
Packaging approachAlN substrates receive individual separation and surface protection appropriate to the finish.
Protection methodsIndividual separation; Anti-scratch interlayers; Rigid trays or foam protection; Moisture protection where appropriate; Inner box and export carton; Wooden case when required
MOQ referenceBy quotation
Lead-time referencesQuotation inputs: Drawing, material, finish, quantity and delivery destination
Payment termsT/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment
Shipping methodsSea freight / Air freight / Door-to-door courier
Protective ceramic component packaging and available international shipping methods

Engineering RFQ

Tell us what the component must do.

Start with your name, work email and a short description. Phone numbers, drawings and technical details are optional.

Add company, drawings or technical details (optional)

Send your initial enquiry now, or add the information you already have.

Drawings (optional)

PDF, JPG/JPEG or PNG. Up to 3 files, 3 MB total. For larger files or CAD files, send your enquiry first and attach them in your email reply.

Your answer is included only in our internal enquiry email, not sent to Google Analytics.

Your request will be reviewed by our team before a technical or commercial response is issued.