Laser Precision-Machined Aluminum Nitride Substrates
Ceramic Substrate
SKU: FWM/CS-ALN-006

- Material
- Aluminum Nitride
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Precision Electronic Packaging
AlN substrates with drawing-defined laser outlines, holes and precision features for electronic assembly.
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Product Description

Laser-machined AlN substrates combine a heat-conducting insulating ceramic body with custom outlines, openings and assembly features.
These features position the substrate within electronic packages and provide clearance or mounting interfaces. Full cuts, shallow scribes and through-holes perform different functions in the finished part.
Holes and outline features illustrate drawing-based processing. Final geometry, feature sizes, tolerances and edge acceptance follow the approved drawing.
Product Advantages
- Machined outlines and openings integrate the carrier with electronic-package features.
- AlN retains its heat-conducting, electrically insulating role around the machined geometry.
- Common reference datums connect cut-outs, holes and mounting locations.
Typical Applications
- Precision Electronic Packaging: shaped AlN carriers fit package outlines and mounting interfaces.
- Custom Circuits: openings and locating features align the ceramic with the assembly.
Technical Data
95% AlN Substrate Properties
| Property | 95% AlN typical value | Condition / method |
|---|---|---|
| AlN content (%) | 95 | — |
| Density (g/cm³) | ≥3.3 | — |
| Flexural strength (MPa) | ≥400 | — |
| Thermal conductivity (W/(m·K)) | ≥170 | Room temperature |
| Relative permittivity | 8–10 | 1 MHz; room temperature |
| Dielectric loss tangent | ≤0.0003 | 1 MHz; room temperature |
| Dielectric strength (kV/mm) | 17 | — |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | — |
How to Read the Parameters
- Hole diameter
State the required finished size in mm or µm.
Specify: Measurement plane, entrance/exit requirements and tolerance.
- Position
Feature location is defined relative to agreed datums.
Specify: Datum scheme, positional tolerance and inspection method.
- Edge condition
Chips, local damage and transition features need explicit criteria.
Specify: Critical edges, allowable defect definition and inspection area.
- Metallized features
A laser hole alone is not an electrical connection.
Specify: Via construction, metal coverage, continuity and isolation requirements when applicable.
Drilled and machined features: geometry and edge control
Drilled and machined ceramics are defined by their finished features and functional surfaces. Specify the required geometry and acceptance criteria before selecting laser or other machining routes.
01Define each feature
Identify locating holes, mounting holes, slots, cut-outs and later metallization features.
02Review geometry and material
Assess ceramic thickness, feature position, spacing and proximity to critical edges.
03Process and prepare
The selected machining sequence creates the features; any cleaning or further finishing is specified for the material and subsequent process.
04Inspect the result
Measure the finished geometry and assess entrance, exit and edge condition against agreed criteria.
Application Conditions & Design Review
Distinguish the feature types
An outline cut, shallow scribe, through-hole and slot are not the same machining requirement. Give each feature a function and datum so the process review can focus on the relevant geometry.
Inspect the processed surface
Non-contact processing does not remove the need to evaluate ceramic damage. Agree how edge chips, cracks, taper, debris and any heat-affected surface will be assessed.
Feature function
Mechanical holes and electrically metallized vias have different requirements.
Thickness and geometry
Hole and slot feasibility depends on the ceramic, thickness and local layout.
Assembly datums
Locate features from the surfaces and datums that control the final assembly.
Send With Your Drawing
- AlN thickness and CAD identifying cuts, scribes, holes and slots.
- Datums, critical dimensions, edge distances and downstream fit requirements.
- Functional-surface protection, later metallization and allowable process damage.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Measure the agreed feature geometry and its location from the specified datums.
- Inspect processed edges and surfaces for unacceptable damage or residue.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- Full-depth outlines, through-holes and slots identified separately from shallow scribes.
- Feature positions, edge distances and entry/exit geometry defined relative to common datums.
- Edge quality, functional-area defects and thickness considered with the selected laser features.
Engineering Questions
Does laser machining mean the ceramic is automatically free of stress or damage?
No. The process must be matched to the material and geometry, and the finished features inspected against agreed damage criteria.
Can the same hole design be used for every ceramic thickness?
Not automatically. Review feature size, shape and edge condition with the selected material and thickness.
If laser drilling is selected, does it include plated-through holes?
No. Drilling defines the opening. Plating or another via conductor is a separate construction that must be specified and qualified.
Packaging & Shipping
AlN substrates receive individual separation and surface protection appropriate to the finish.
| Item | Details |
|---|---|
| Packaging approach | AlN substrates receive individual separation and surface protection appropriate to the finish. |
| Protection methods | Individual separation; Anti-scratch interlayers; Rigid trays or foam protection; Moisture protection where appropriate; Inner box and export carton; Wooden case when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |





