99.6% Alumina Ceramic Substrates for Chip Resistors
Ceramic Substrate
SKU: FWM/CS-ALU-010
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Chip Resistors
High-purity alumina substrate panels for chip-resistor manufacturing and precision thick-film processing.
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Product Description
Alumina substrate panels support the conductor and resistive films used to manufacture chip resistors.
Electrical insulation separates adjacent circuit elements, while the rigid panel supports printing, firing, trimming and separation. The final resistance and temperature coefficient depend on the resistor film and processing as well as the ceramic.
Bare alumina substrates are shown, not finished resistors or verified resistive films. Scribing and film-processing requirements are reviewed separately.
Product Advantages
- An insulating panel separates adjacent resistor and conductor positions.
- The rigid carrier supports printing, firing and trimming before singulation.
- Panel and scribe layouts organize repeated chip positions through processing.
Typical Applications
- Chip Resistors: ceramic panels carry the resistive and conductor films.
- Thick-Film Circuits: the substrate supports printed and fired functional layers.
Technical Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Treat the substrate and paste as a system
Resistor manufacture depends on how the chosen conductor and resistor materials interact with the ceramic during printing and firing. The substrate grade should be evaluated with the intended paste system.
Plan panel processing through singulation
Registration, scribe layout and edge quality affect the transition from a printed panel to individual components. Include the trimming and separation sequence in the design review.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Alumina grade, panel format, thickness and surface specification.
- Conductor/resistor paste system and the intended firing and trimming sequence.
- Component array, scribe map, registration features and final edge criteria.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect surface defects, panel geometry and registration features before printing.
- Validate film adhesion and final resistor behavior with the selected paste and process.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 99.6% alumina panels with defined chip layout, margins and registration datums.
- Plain or scribed panel configurations coordinated with the separation sequence.
- Thickness, surface condition and final edge quality specified for printing and singulation.
Engineering Questions
Does 99.6% alumina guarantee a resistance tolerance or TCR?
No. Those are finished-resistor characteristics determined by the film system, processing, trimming and test conditions as well as the substrate.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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