99.6% Alumina Substrates for Precision Electronics
Ceramic Substrate
SKU: FWM/CS-ALU-008
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- High-Performance Electronics
99.6% alumina substrates for precision electronic assemblies requiring high insulation and controlled surface quality.
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Product Description
High-purity alumina substrates are insulating carriers for precision circuits, component attachment and electronic packaging.
They combine ceramic stiffness and electrical insulation with a surface that can be prepared for the selected film or metallization process. Purity, finish and circuit processing work together rather than substituting for one another.
Bare alumina is shown for material and form selection. Purity, dimensions and application qualification cannot be established from appearance.
Product Advantages
- High-purity alumina combines electrical isolation with a rigid circuit-support surface.
- The selected surface condition supports film processing or component attachment.
- Custom outlines and features adapt the carrier to compact electronic-package interfaces.
Typical Applications
- High-Performance Electronics: insulating surfaces carry circuit layers and component attachment areas.
- Electronic Packaging: tailored carrier geometry integrates the ceramic into the package.
Technical Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Select for the actual circuit technology
High-performance electronics can mean different things: fine films, heat removal, insulation or dimensional control. Start by naming the limiting requirement rather than treating a purity percentage as a complete specification.
Match the surface to the next operation
A carrier intended for printed circuitry may need a different surface from one used for precision deposition or die attachment. Specify the supply state and the operations that follow.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Material grade and the electrical, thermal or mechanical requirement driving selection.
- Finished geometry, critical datums and designated functional surfaces.
- Subsequent circuit process, attachment method and inspection requirements.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Confirm material identification and drawing-defined geometry and surface criteria.
- Qualify the selected construction under its intended circuit and assembly conditions.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 99.6% alumina carriers with drawing-defined outline and thickness.
- Surface finish selected for the intended film, metallization or attachment process.
- Holes, slots and edge details defined with their functional datums.
Engineering Questions
Is higher alumina purity always the best choice?
Not necessarily. Surface quality, thermal behavior, process compatibility, geometry and cost also matter. Compare suitable grades against the complete application rather than purity alone.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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