Alumina Ceramic Substrates for Crystal Oscillators
Ceramic Substrate
SKU: FWM/CS-ALU-007
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- Crystal Oscillators
High-purity alumina substrates for stable crystal-oscillator circuit support and microelectronic packaging.
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Product Description
Alumina substrates support the resonator and associated circuitry in crystal-oscillator and frequency-control assemblies.
The rigid insulating ceramic carries circuit features and attachment areas within a compact package. Frequency stability and hermetic sealing are properties of the completed assembly, not the bare substrate alone.
Bare alumina is shown for material and form selection. Purity, dimensions and application qualification cannot be established from appearance.
Product Advantages
- A rigid insulating platform supports the resonator and associated circuit elements.
- Compact attachment areas organize component placement within the oscillator package.
- Ceramic geometry provides repeatable mechanical interfaces for subsequent assembly.
Typical Applications
- Crystal Oscillators: the ceramic supports resonator and circuit attachment areas.
- Frequency-Control Modules: insulating carriers organize electronic components within the package.
Technical Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Minimize stress at the resonator
The carrier layout and attachment scheme should allow the crystal and oscillator components to be mounted without imposing uncontrolled mechanical stress. Define mounting interfaces and sealing features explicitly.
Keep calibration at the assembly level
A substrate drawing can control dimensions, surface condition and pads. Frequency accuracy, drift and phase noise must be evaluated after the resonator, circuit and package are assembled.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Carrier and cavity geometry, mounting datums and crystal support locations.
- Pad pattern, surface finish and crystal/component attachment materials.
- Sealing interface, operating environment and final oscillator test requirements.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect mounting geometry, surface cleanliness and pad registration.
- Validate frequency behavior after assembly and the required environmental exposure.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 99.6% alumina outlines and attachment areas matched to the package layout.
- Thickness, surface finish and mounting datums defined for component attachment.
- Bare or metallized carriers specified separately from a sealed oscillator assembly.
Engineering Questions
Is a bare alumina substrate a hermetic oscillator package?
No. Hermeticity depends on the complete enclosure, feedthroughs and sealing process. Specify and test the finished package if a leak-rate requirement applies.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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