99.6% Alumina Ceramic Substrates for Laser Diodes
Ceramic Substrate
SKU: FWM/CS-ALU-012
- Material
- Alumina
- Size
- Custom sizes by drawing
- MOQ
- By quotation
- Applications
- High-Power Laser Diodes
High-purity alumina substrates for laser-diode submounts and precision optoelectronic packaging.
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Product Description
Alumina submounts support laser-diode positioning and electrically isolate the device within an optoelectronic package.
The ceramic provides a rigid attachment surface and part of the heat path from the diode to its package. Thermal performance also depends on the die footprint, attachment layer and backside cooling contact.
Representative bare carrier forms are shown. Package outline, alumina purity, metallization and assembly interfaces require separate confirmation.
Product Advantages
- An insulating submount separates the laser diode electrically from its package base.
- A rigid attachment face supports device location within the package.
- The ceramic provides part of the heat path between the diode attachment and the cooling contact.
Typical Applications
- High-Power Laser Diodes: ceramic submounts support device attachment and electrical isolation.
- Optoelectronic Modules: mounting datums connect the device footprint to the package.
Technical Data
99.6% Alumina Substrate (710 C) Properties
| Property | 99.6% Al₂O₃ — 710 C | Test conditions / measurement tolerance ±10% |
|---|---|---|
| Density (g/cm³) | ≥3.80 | DIN EN 993-1 |
| Bending strength, σ₀ (MPa) | ≥420 | ASTM C1499-08 |
| Young’s modulus (GPa) | ≥300 | — |
| Thermal conductivity (W/(m·K)) | ≥25 | Room temperature; DIN EN 821-2 |
| Linear thermal expansion coefficient (10⁻⁶/K) | 7–9 | 100–800°C; DIN 51045-1 |
| Specific heat capacity (J/(g·K)) | ≥0.65 | 20°C; DIN EN 821-3 method B |
| Relative permittivity | 8.5–11.5 | Room temperature, 1 MHz |
| Dielectric loss factor | ≤0.010 | Room temperature; 1 MHz; Ra ≤0.4 µm |
| Volume resistivity (Ω·cm) | ≥10¹⁴ | Room temperature; IEC 62631-3 |
| Breakdown strength (kV/mm) | AC≥15; DC≥15 | 20°C; AC / DC |
| Fracture toughness (MPa·m½) | ≥3.0 | Indentation-fracture (IF) |
How to Read the Parameters
- Purity
Composition identifies a material class, not a guaranteed circuit result.
Specify: Grade designation and relevant property report.
- Surface texture
Ra or Rq describes a defined ceramic surface in µm or nm.
Specify: Functional face, measurement method and local defect criteria.
- Flatness and thickness
Flatness, total thickness variation and parallelism describe different geometry.
Specify: Datums, span, support state and measurement method.
- Electrical properties
Volume resistivity uses Ω·cm or Ω·m; insulation resistance uses Ω.
Specify: Temperature, humidity, voltage, electrification time and specimen geometry.
Alumina: material and surface selection
Alumina is an electrically insulating ceramic platform for printed-film, thin-film and package constructions. Purity, surface condition and geometry must be selected for the downstream process; a bare plate is not a completed circuit.
01Define the grade
Select the alumina formulation and the intended film, metallization or assembly route.
02Form and fire
Ceramic forming and firing establish the body; the chosen route must account for shrinkage and the required finished geometry.
03Finish functional features
Where specified, machine or laser-process features and prepare the functional surfaces.
04Inspect the delivered condition
Assess dimensions, surfaces and edge condition against the drawing before later circuit processing.
Application Conditions & Design Review
Control the laser-to-cooler interfaces
A laser submount connects a small heat source to a larger cooling structure. Define the die footprint, attachment layer and backside interface so the thermal path can be assessed as an assembly.
Keep alignment and attachment compatible
Pad finish and bonding method must suit both electrical interconnection and mechanical alignment. Review dimensional datums and thermal-expansion effects with the intended laser package.
Film compatibility
Select the grade and surface for the actual resistor, conductor or deposited-film system, not purity alone.
Functional geometry
Identify circuit areas, datums, mounting features and separation edges.
Thermal and electrical role
Balance ceramic thickness, heat transfer and isolation within the completed assembly.
Send With Your Drawing
- Die footprint, optical alignment datums and submount geometry.
- Metallization/finish requirements and the chosen die-attach and wire-bond processes.
- Dissipated heat, cooling interface and allowable device temperature.
Include the drawing revision, sample and production quantities, and required inspection documents.
Define Acceptance Before Production
- Inspect functional surface geometry, pad registration and finish condition.
- Evaluate attachment integrity and thermal performance on representative assembled submounts.
Agree the test methods, sampling plan, acceptance limits and required reports before production.
Available Forms & Processing
Product-specific geometry and processing features.
- 99.6% alumina submount outlines, thicknesses and device-position datums.
- Attachment-face finish and flatness defined independently from backside contact geometry.
- Bare or metallized interfaces identified to suit the specified die-attachment process.
Engineering Questions
When should AlN be compared with alumina for a laser submount?
Compare them when the heat-removal requirement is difficult to meet within the available footprint and thickness. Include attachment layers, cooling and mechanical requirements in that comparison.
Is higher-purity alumina always the better substrate?
No. The preferred grade depends on film compatibility, surface condition, geometry and assembly needs. Purity alone does not establish resistor stability or thin-film yield.
Does a hole in alumina provide an electrical via?
No. A hole is a geometric feature until a compatible conductor or metallization structure is specified and qualified.
Packaging & Shipping
Packaging is selected for substrate finish, quantity and export handling.
| Item | Details |
|---|---|
| Packaging approach | Packaging is selected for substrate finish, quantity and export handling. |
| Protection methods | Individual separation; Anti-scratch interlayers for polished surfaces; Tray or foam protection; Inner box and export carton; Moisture protection where appropriate; Wooden case for larger export consignments when required |
| MOQ reference | By quotation |
| Lead-time references | Quotation inputs: Drawing, material, finish, quantity and delivery destination |
| Payment terms | T/T / Western Union / PayPal; 50% advance payment, 50% balance before shipment |
| Shipping methods | Sea freight / Air freight / Door-to-door courier |
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